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Results 2231-2236 of 2236 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| New Anisotropic Conductive Adhesives for Low Cost and Reliable Flip Chip on Organic Substrates Applications Yim, MJ; Paik, Kyung-Wook, 2000 Int’l Symp on Electronic Materials & Packaging, pp.282 - 288, 2000 Int’l Symp on Electronic Materials & Packaging, 2000-11-01 | |
| Study on Coined Solder Bumps on Micro-via PCBs Nah, JW; Paik, Kyung-Wook; Kim, WH; Hur, KR, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.115 - 120, 3rd International Symposium on Electronic Materials and Packaging, 2001-11 | |
| Numerical Analysis of the Formation of Coined Solder Bumps Hwnag, TK; Lee, SB; Nah, JW; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.388 - 392, 3rd International Symposium on Electronic Materials and Packaging, 2001-11 | |
| Flip chip assembly on organic boards using anisotropic conductive adhesives (ACAs) and nickel/gold bumps Yim, MJ; Jeon,YD; Paik, Kyung-Wook, 2000 Electronics Packaging Technology Conference(3rd EPTC), pp.378 - 384, EPTC, 2000-12-01 | |
| In-situ moiré measurement of adhesive flip-chip bonded assembly under thermal cycling condition Ham, SJ; Kwon, WS; Paik, Kyung-Wook; Lee, Soon-Bok, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.63 - 67, IEEE, 2002-06 | |
| Microstructural properties of closely stacked InAs quantum dots inserted in GaAs layers embedded in modulation-doped Al0.25Ga0.75As/GaAs heterostructures 이정용, 제8회 한국반도체학술대회, pp.579 - 580, KCS, 2001-02 |
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