Flip chip assembly on organic boards using anisotropic conductive adhesives (ACAs) and nickel/gold bumps
- Publisher
- EPTC
- Issue Date
- 2000-12-01
- Language
- English
- Citation
2000 Electronics Packaging Technology Conference(3rd EPTC), pp.378 - 384
- Appears in Collection
- MS-Conference Papers(학술회의논문)
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- There are no files associated with this item.
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