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Results 2201-2210 of 2236 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Mechanical Properties of Nanocrystalline WC-10Co Hardmetals Hong, Soon-Hyung, 2000. TMS Annual Meeting & Exhibition, TMS, 2000-01-01 | |
| Comparison of electroplated eutectic Sn/Bi and Pb/Sn solder bumps on various UBM systems Jang, Se-Young; Paik, Kyung-Wook, 50th Electronic Components and Technology Conference, pp.64 - 68, IEEE, 2000-05-01 | |
| Significant Reliablity Enhancement Using New Anisotropic Conductive Adhesives for Flip Chip on Organic Substrates Applications Paik, Kyung-Wook; Kwon, WS; Yim, MJ, 2001 Pan Pacific Microelectronics Symposium, pp.217 - 223, Pan Pacific Microelectronics Symposium, 2001-02-01 | |
| The effects of Sr/Ti ratio on the step coverage of SrTiO3 thin films fabricated using ECR-PEMOCVD Park, SY; Choi, J; No, Kwangsoo, 12th IEEE International Symposium on Applications of Ferroelectrics, pp.59 - 63, IEEE, 2000-07-21 | |
| Simulation and characterization of silicon oxynitrofluoride films as a phase shift mask material for 157 nm optical lithography Kim, S; Choi, E; Kim, H; Kim, J; No, Kwangsoo, Optical Microlithography XV, pp.1696 - 1702, SPIE, 2002-03-06 | |
| An electric field detector using electro-optic device Lee, C; Jeon, Y; Jeong, D; Yeom, Ik Jun; No, Kwangsoo, Optomechatronic Systems II, pp.311 - 322, SPIE, 2001-10-29 | |
| The Alloy Design of the Pb-free High-temperature Solder System Lee, Hyuck Mo; Kim, JH, The 4th Pacific Rim International Conference on Advanced Materials and Processing, pp.1079 - 1082, The 4th Pacific Rim International Conference on Advanced Materials and Processing, 2001-12-11 | |
| Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.950 - 956, Electronic Components and Technology Conference, 2001-05-29 | |
| Relationships between suspension formulations and the properties of BaTiO3/epoxy composite films for integral capacitors Cho, SD; Paik, Kyung-Wook, 51st 2001 Electronic Components and Technology Conference, pp.1418 - 1422, IEEE, 2001-05-29 | |
| Investigation of low cost flip chip under bump metallization (UBM) systems on Cu pads Nah, JW; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.790 - 795, IEEE, 2001-05-29 |
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