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Results 181-187 of 187 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
181
Transparent amorphous oxide thin film transistors fabricated by solution coating process

Seo, SJ; Choi, CG; Hwang, YH; Bae, Byeong-Soo, 2008 SID International Symposium, pp.1254 - 1257, 123, 2008-05-20

182
Wafer to wafer bonding using electroplated Co-Sn solder layer

Kim, SH; Yu, Jin, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 123, 2008-10-22

183
Surface modification of Ni/Ni3Al two-phase foils by electrochemically selective etching

Lee, HY; Demura, M; Xu, Y; Wee, Dang-Moon; Hirano, T, 2008 MRS Fall Meeting, pp.269 - 274, 123, 2008-12-02

184
Wafer level ACA packages and their applications to advanced electronic packaging

Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09

185
PDP fabricated with low-temperature processes below 300째C using sol-gel hybrid polymers (hybrimer PDP)

Bae, Byeong Soo; Kim, JH; Ko, J; Jung, K; Jin, J; Yang, S; Kim, SW; Jeon, Duk Young, 2008 SID International Symposium, pp.1446 - 1449, 123, 2008-05-20

186
The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for ACF FlipChip interconnection

Chung, CK; Paik, Kyung-Wook, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.20 - 24, 123, 2008-10-22

187
Dielectric properties of SrTiO3 thin films on SrRuO3 seed prepared by plasma-enhanced atomic layer deposition

Ahn J.-H.; Kim J.-Y.; Kim J.-H.; Roh J.-S.; Kang S.-W., Physics and Technology of High-k Gate Dielectrics 6 - 214th ECS Meeting, pp.335 - 339, 123, 2008-10-13

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