Results 181-187 of 187 (Search time: 0.004 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Transparent amorphous oxide thin film transistors fabricated by solution coating process Seo, SJ; Choi, CG; Hwang, YH; Bae, Byeong-Soo, 2008 SID International Symposium, pp.1254 - 1257, 123, 2008-05-20 | |
Wafer to wafer bonding using electroplated Co-Sn solder layer Kim, SH; Yu, Jin, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316, 123, 2008-10-22 | |
Surface modification of Ni/Ni3Al two-phase foils by electrochemically selective etching Lee, HY; Demura, M; Xu, Y; Wee, Dang-Moon; Hirano, T, 2008 MRS Fall Meeting, pp.269 - 274, 123, 2008-12-02 | |
Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09 | |
PDP fabricated with low-temperature processes below 300째C using sol-gel hybrid polymers (hybrimer PDP) Bae, Byeong Soo; Kim, JH; Ko, J; Jung, K; Jin, J; Yang, S; Kim, SW; Jeon, Duk Young, 2008 SID International Symposium, pp.1446 - 1449, 123, 2008-05-20 | |
The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for ACF FlipChip interconnection Chung, CK; Paik, Kyung-Wook, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.20 - 24, 123, 2008-10-22 | |
Dielectric properties of SrTiO3 thin films on SrRuO3 seed prepared by plasma-enhanced atomic layer deposition Ahn J.-H.; Kim J.-Y.; Kim J.-H.; Roh J.-S.; Kang S.-W., Physics and Technology of High-k Gate Dielectrics 6 - 214th ECS Meeting, pp.335 - 339, 123, 2008-10-13 |
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