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Results 201-208 of 208 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with Electroless Nickel Immersion Gold (ENIG) surface finish Park, YS; Kwon, YM; Son, HY; Moon, JT; Jeong, BW; Kang, KI; Paik, Kyung-Wook, The 9th International Conference on Electronic Materials and Packaging, EMAP 2007, pp.0, 123, 2007-11-19 | |
| First-principles calculations on electronic structure of PbTe Dow, HS; Oh, MW; Kim, BS; Park, SD; Lee, HW; Wee, Dang-Moon, ICT'07 - 26th International Conference on Thermoelectrics, pp.90 - 93, 123, 2007-06-03 | |
| Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications Son, HY; Jung, GJ; Lee, JK; Choi, JY; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871, IEEE, 2007-05-29 | |
| Ultrasonic Anisotropic Conductive Films (ACFs) bonding of flexible substrates on organic rigid boards at room temperature Lee, K; Kim, HJ; Kim, I; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.480 - 486, IEEE, 2007-05-29 | |
| Fabrication of a direct-type silicon pixel detector for a large area hybrid X-ray imaging device Park, KS; Kim, TW; Yoon, YS; Park, JM; Kang, JY; Koo, JG; Kim, BW; Kosonen, J; No, Kwangsoo, 2007 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS-MIC, pp.3446 - 3449, IEEE, 2007-10-27 | |
| Development and evaluation of 3-D SiP with vertically interconnected Through Silicon Vias (TSV) Jang, DM; Ryu, C; Lee, KY; Cho, BH; Kim, Joungho; Oh, TS; Lee, Won-Jong; Yu, Jin, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.847 - 852, IEEE, 2007-05-29 | |
| Development of a New Buffer Layer for Cu(In,Ga)Se2 Solar Cells Ahn, Byung Tae, Molecular and Nanoscale Systems for Energy Conversion, 123, 2007-10-01 | |
| Effect of Deformation Route on the Mechanical Properties of CP-Ti Deformed by Equal Channel Angular Pressing (ECAP) Park, Joong Keun, Key Engineering Materials, pp.125 - 128, Trans Tech Publications Ltd., 2007-08 |
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