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Results 111-119 of 119 (Search time: 0.003 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Relationships between suspension formulations and the properties of BaTiO3/epoxy composite films for integral capacitors Cho, SD; Paik, Kyung-Wook, 51st 2001 Electronic Components and Technology Conference, pp.1418 - 1422, IEEE, 2001-05-29 | |
| Investigation of low cost flip chip under bump metallization (UBM) systems on Cu pads Nah, JW; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.790 - 795, IEEE, 2001-05-29 | |
| Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, YJ; Paik, Kyung-Wook; Koh, KW; Woon, JH; Choi, SH; Lee, J; Moon, JT; Park, YJ, Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging 2001, pp.44 - 51, International Symposium on Electronic Matericals and Packaging, 2001-11 | |
| Effects of particle size on dielectric constant and leakage current of epoxy/barium titanate (BaTiO3) composite films for embedded capacitors Cho, SD; Lee, JY; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging, pp.63 - 68, 3rd International Symposium on Electronic Matericals and Packaging, 2001-11-01 | |
| New Anisotropic Conductive Adhesives for Low Cost and Reliable Flip Chip on Organic Substrates Applications Yim, MJ; Paik, Kyung-Wook, 2000 Int’l Symp on Electronic Materials & Packaging, pp.282 - 288, 2000 Int’l Symp on Electronic Materials & Packaging, 2000-11-01 | |
| Study on Coined Solder Bumps on Micro-via PCBs Nah, JW; Paik, Kyung-Wook; Kim, WH; Hur, KR, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.115 - 120, 3rd International Symposium on Electronic Materials and Packaging, 2001-11 | |
| Numerical Analysis of the Formation of Coined Solder Bumps Hwnag, TK; Lee, SB; Nah, JW; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.388 - 392, 3rd International Symposium on Electronic Materials and Packaging, 2001-11 | |
| Flip chip assembly on organic boards using anisotropic conductive adhesives (ACAs) and nickel/gold bumps Yim, MJ; Jeon,YD; Paik, Kyung-Wook, 2000 Electronics Packaging Technology Conference(3rd EPTC), pp.378 - 384, EPTC, 2000-12-01 | |
| In-situ moiré measurement of adhesive flip-chip bonded assembly under thermal cycling condition Ham, SJ; Kwon, WS; Paik, Kyung-Wook; Lee, Soon-Bok, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.63 - 67, IEEE, 2002-06 |