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Results 1-10 of 12 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effects of BaTiO3 content and size on the viscosity and curing behavior of B-stage Epoxy/BaTiO3 composite Embedded Capacitor Films (ECFs) Jang, Jong Min; Lee, Sangyong; Paik, Kyung-Wook, The 11th International Conference on Electronic Materials and Packaging, 2009-12 | |
| Embedded chip-in-flex (cif) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs) Suk, KL; Son, HY; Chung, CK; Kim, JD; Lee, JW; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1741 - 1748, 2009-05-26 | |
| Study of drop-performance improved lead-free solder by PCB pad finish Lee, YW; Lee, JH; Moon, JT; Park, YS; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.668 - 672, 2009-12-09 | |
| Patterning of wafer level applied non-conductive adhesives (NCAs) for camera image sensor (CIS) modules Kim, I; Son, HY; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.1806 - 1810, 2009-05-26 | |
| Reliability enhancement of embedded capacitors in printed circuit boards using b-stage epoxy/batio3 composite embedded capacitor films (ECFS) Lee, S; Jang, JM; Lee, WS; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.771 - 776, 2009-05-26 | |
| 20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives Chuang, CC; Lu, ST; Chang, TC; Suk, KL; Paik, Kyung-Wook, IMPACT Conference 2009 International 3D IC Conference, pp.56 - 59, 2009-10-21 | |
| Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; Byun, KY; Joh, CH; Do, EH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.942 - 946, 2009-12-09 | |
| Bumpless ball grid array (BBGA) package using a solder resist cavity Kwon, YM; Kang, JS; Kweon, YD; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, 2009, pp.1552 - 1556, 2009-05-26 | |
| Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability Park, YS; Kwon, YM; Moon, JT; Lee, YW; Lee, JH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.321 - 324, 2009-12-09 | |
| Characterization of Epoxy/BaTiO3 composite embedded capacitors for high frequency behaviors Hyun, JG; Paik, Kyung-Wook; Pak, JS, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.2046 - 2050, 123, 2009-05-26 |
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