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Results 191-200 of 222 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
191
Fabrication Processes and Properties of Carbon Nanotube Nanocomposites

Hong, Soon Hyung, Nano Science & Technology Symposium, UKC-2006 Nano Symposium, Nano Science & Technology Symposium, UKC-2006 Nano Symposium, 2006-08

192
Novel Fabrication Process for Carbon Nanotube Nanocomposites

Hong, Soon Hyung, ICM/NFT'06, ICM/NFT'06, 2006-05

193
Precipitate Of As-forged Al-zn-mg-cu-sc Alloy After Aging Process

Ryu, MK; Kwon O.Y.; Park, TW; Lee, YY; Hong, Soon Hyung, Fall Meeting of The Korean Institute of Metals and Materials, pp.135 - 135, 대한금속재료학회, 2006-10-27

194
Fabrication Process and Magnetostriction of Grain-aligned Terfenol-D/Epoxy Composite

Kwon Oh Yeoul; Hong, Soon Hyung, ACCM-5, ACCM-5, 2006-11

195
Membrane Electrode Assembly for a Polymer Electrolyte Fuel Cell Under Non-humidified Conditions

Cho, Eun-Ae; Kim, HJ.; Lee, SY.; Vengatesan, S.; Lim, TH.; Oh, IH., Small Fuel Cell, Small Fuel Cell, 2006-04

196
IUPAc Inter. symposium on advanced polymers for emerging technologies

Cho, Eun-Ae; Kim, HJ.; Lee, SY; Ha, HY; Oh, IH.; Lim, TH, IUPAc Inter. symposium on advanced polymers for emerging technologies, IUPAc Inter. symposium on advanced polymers for emerging technologies, 2006-10-10

197
Synthesis and size control of monodisperse spherical Y2O 3:Eu3+ phosphor and its photoluminescence properties

Yoo, HS; Jang, HS; Im, WB; Kang, JH; Jeon, Duk Young, 13th International Display Workshops, IDW '06, pp.389 - 392, 123, 2006-12-06

198
Fabrication of the poly-Si thin film transistor on the mica substrate

Lee, SR; Lee, JH; Ahn, Byung Tae, IMID/IDMC 2006: 6th Internaional Meeting on Information Display and the 5th International Display Manufacturing Conference, pp.1182 - 1184, 123, 2006-08-22

199
Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM

Kwon, YM; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging, EMAP 2006, 123, 2006-12-11

200
Novel non-conductive films(NCFs) with multi-functional epoxies and silica fillers for reliable NCFs flip-chip-on-organic boards

Chung, CK; Kim, HJ; Paik, Kyung-Wook, 2006 International Conference on Electronic Materials and Packaging, EMAP, 123, 2006-12-11

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