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Results 1-10 of 13 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Epoxy/BaTiO (SrTiO3) Composite Films and Pastes for High Dielectric Constant and Low Tolerance Embedded Capacitors in Organic Substrates Paik, Kyung-Wook; Hyun, JG; Lee, S; Jang, KW, Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2006-01 | |
| Epoxy/BaTio3 (SrTiO3) Composite Films and Pastes for Organic Substrates Applications Paik, Kyung-Wook, UKC 2006 (US-Korea Conference on Science, Technology, and Entrepreneurship), pp.0 - 0, 2006-08-01 | |
| Multi-functional epoxy/SrTiO3 ceramic powder Embedded Capacitor Films(ECFs) for organic substrates Lee, S; Hyun, JG; Chung, CK; Paik, Kyung-Wook, 2006 8th Electronics Packaging Technology Conference, EPTC, pp.549 - 552, 2006-12-06 | |
| Epoxy/BaTiO3 (SrTi03) composite films and pastes for high dielectric constant and low tolerance embedded capacitors in organic substrates Paik, Kyung-Wook; Hyun, JG; Lee, S; Jang, KW, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.794 - 801, 2006-09-05 | |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging, EMAP 2006, 123, 2006-12-11 | |
| Novel non-conductive films(NCFs) with multi-functional epoxies and silica fillers for reliable NCFs flip-chip-on-organic boards Chung, CK; Kim, HJ; Paik, Kyung-Wook, 2006 International Conference on Electronic Materials and Packaging, EMAP, 123, 2006-12-11 | |
| A study on epoxy/BaTiO3 embedded capacitor pastes for organic substrates Jang, KW; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.1504 - 1509, IEEE, 2006-05-30 | |
| Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications Yim, MJ; Kim, HJ; Chung, CK; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.338 - 343, IEEE, 2006-05-30 | |
| Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection Lee, KW; Kim, HJ; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.918 - 923, IEEE, 2006-05-30 | |
| Effect of conductive particle properties on the reliability of anisotropic conductive film for Chip-On-Glass (COG) applications Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp.38 - 0, 123, 2006-03-15 |
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