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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Embedded chip-in-flex (cif) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs) Suk, KL; Son, HY; Chung, CK; Kim, JD; Lee, JW; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1741 - 1748, 2009-05-26 | |
| Effects of epoxy and rubber addition on die attach films (DAFs) materials properties Choi, Y; Jang, KW; Chung, CK; Lee S.; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, ECTC 2009, pp.1525 - 1530, 123, 2009-05-26 | |
| The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for chip-on-flex (COF) applications Chung, CK; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.161 - 167, 123, 2009-05-26 |
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