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Results 51-60 of 119 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
51
Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage

Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; Byun, KY; Joh, CH; Do, EH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.942 - 946, 2009-12-09

52
Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs)

Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01

53
Bumpless ball grid array (BBGA) package using a solder resist cavity

Kwon, YM; Kang, JS; Kweon, YD; Paik, Kyung-Wook, 59th Electronic Components and Technology Conference, 2009, pp.1552 - 1556, 2009-05-26

54
Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability

Park, YS; Kwon, YM; Moon, JT; Lee, YW; Lee, JH; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.321 - 324, 2009-12-09

55
Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature

Nah, JW; Suh, JO; Paik, Kyung-Wook; Tu, KN, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.50 - 53, 2005-03-16

56
Thermomechanical stress analysis of Multilayer PCBs consisting of metals and viscoelastic polymers

Paik, Kyung-Wook; Lim, JH; Kim, JS; Earmme, YY, International Conference on Fracture & Strength of Solids 2000, pp.0 - 0, 2000-12-01

57
Epoxy/BaTiO3 (SrTi03) composite films and pastes for high dielectric constant and low tolerance embedded capacitors in organic substrates

Paik, Kyung-Wook; Hyun, JG; Lee, S; Jang, KW, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.794 - 801, 2006-09-05

58
High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications

Yim, MJ; Hwang, JS; Kwon, WS; Jang, KW; Paik, Kyung-Wook, 2002 Electronic Components & Technology Conference , pp.1385 - 1389, 2002 Electronic Components & Technology Conference, 2002-05-28

59
Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications

Yim, MJ; Hwang, JS; Kim, JG; Kim, HJ; Kwon, W; Jang, KW; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164, IEEE, 2004-06-01

60
Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications

Yim, MJ; Jung, IH; Choi, HK; Kim, K; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, 53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403, IEEE, 2003-05-27

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