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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27 | |
| Fabrication and characterization of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO3 composite embedded capacitor films (ECFs) Lee, S; Hyun, JG; Pak, JS; Lee, H; Jeon, HS; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.742 - 746, 2008-05-27 | |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son H.-Y.; Kim I.; Park J.-H.; Lee S.-B.; Jung G.-J.; Park B.-J.; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2035 - 2043, 2008-05-27 | |
| Fabrication and characterization of epoxy/bari0 composite embedded capacitor for high frequency behaviors Hyun, JG; Paik, Kyung-Wook; Pak, JS, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.124 - 128, 2008-10-22 | |
| Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs Paik, Kyung-Wook; Kim, Il; Son, Ho-Young; Chung, Chang-Kyu, Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs, pp.0 - 0, 2008 | |
| Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09 | |
| The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for ACF FlipChip interconnection Chung, CK; Paik, Kyung-Wook, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.20 - 24, 123, 2008-10-22 |
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