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NO	Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1	Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09
2	The effects of the degree of cure of anisotropic conductive films (ACFs) on the contraction stress build-up of ACFs and ACF joints stability for ACF FlipChip interconnection Chung, CK; Paik, Kyung-Wook, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.20 - 24, 123, 2008-10-22

Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)

Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09

Chung, CK; Paik, Kyung-Wook, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.20 - 24, 123, 2008-10-22

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