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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs) Paik, Kyung-Wook; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 123, 2007-01-15 | |
| Theoretical prediction and experimental measurement of the degree-of-cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) applications Chung, CK; Kwon, YM; Kim, I; Son, HY; Choo, KS; Kim, SJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 123, 2007-11-19 | |
| Non-Conductive Films (NCFs) with multi-functional epoxies and silica fillers for reliable NCFs Flip Chip on Organic Boards (FCOB) Chung, CK; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1831 - 1838, IEEE, 2007-05-29 |
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