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Results 11-11 of 11 (Search time: 0.002 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications Son, HY; Jung, GJ; Lee, JK; Choi, JY; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871, IEEE, 2007-05-29 |