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NO	Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1	Effects of Electrical Current on the Failure Mechanisms of Au stud bumps/ACF Flip Chip Joints under High Current Stressing Condition Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 5th International Conference on Electronic Materials and Packaging, pp.203 - 208, 2003-11
2	Study on thermal cycling reliability and delamination of anisotropic conductives adhesives flip chip on organic substrates with emphasis on the thermal deformation Kwon, WS; Paik, Kyung-Wook, 3rd International IEEE Conference on Polymers and Adhesives In Microelectronics and Photonics, 2003-10
3	Experimental Analysis of Compressive Stresses in ACF Flip Chip Joint and Its Influence on ACF Joint Reliability Kwon, WS; Paik, Kyung-Wook, 2003 International Electronic Packaging Technical Conference and Exhibition, v.1, pp.131 - 136, 2003-07-06

Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)

Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 5th International Conference on Electronic Materials and Packaging, pp.203 - 208, 2003-11

Kwon, WS; Paik, Kyung-Wook, 3rd International IEEE Conference on Polymers and Adhesives In Microelectronics and Photonics, 2003-10

Kwon, WS; Paik, Kyung-Wook, 2003 International Electronic Packaging Technical Conference and Exhibition, v.1, pp.131 - 136, 2003-07-06

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