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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Thermal stability at the anisotropic conductive films (ACFs) / organic solderability preservatives (OSPs) interface Kim, I; Kim, HJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 | |
| Room temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications Lee, K; Kim, HJ; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0, 123, 2007-11-19 | |
| Adhesion and reliability of Anisotropic Conductive Films (ACFs) joints on Organic Solderability Preservatives (OSPs) metal surface finish Kim, HJ; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1707 - 1713, IEEE, 2007-05-29 | |
| Ultrasonic Anisotropic Conductive Films (ACFs) bonding of flexible substrates on organic rigid boards at room temperature Lee, K; Kim, HJ; Kim, I; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.480 - 486, IEEE, 2007-05-29 |
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