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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A Study on Copper-to-Copper Contacts in NMBITM(Neo-Manthattna Bump Interconnection Structure) Kim, HJ; Paik, Kyung-Wook; Lee, SG; Han, JW; Hwang, JH; Lee, SM, 6th International Conference on Electronic Materials and Packaging, pp.0 - 0, 2004-12-01 | |
| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Hwang, JS; Kim, JG; Kim, HJ; Kwon, W; Jang, KW; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164, IEEE, 2004-06-01 |
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