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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Studies on double-layered metal bumps for fine pitch flip chip applications Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; Cho, SJ; Paik, Kyung-Wook, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11 |
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