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Understanding size effects in the advanced through-silicon via interconnect schemes for 3D ICs

Ali, Imran; Radchenko, Ihor; Tippabhotla, Sasi Kumar; Ridhuan, Song Wenjian M.; Tay, Andrew A. O.; Tamura, Nobumichi; Han, Seung Min Jane; et al, 18th IEEE Electronics Packaging Technology Conference, EPTC 2016, pp.748 - 751, Institute of Electrical and Electronics Engineers Inc., 2016-11

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