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1
A comparative study of ENIG and Cu OSP surface finishes on the mechanical reliability of Sn-3.0Ag-0.5Cu and Sn-36.8Pb-0.4Ag solders

Jee, YK; Sohn, YC; Yu, Jin; Lee, TY; Seo, HN; Kim, KH; Ahn, JH; et al, 2006 International Conference on Electronic Materials and Packaging, EMAP, pp.571 - 579, 2006-12-11

2
Comparison between Electroless Ni(P)Au and Cu OSP as a Surface Finish Layer of Mobile Application

Yu, Jin; Sohn, YC; Jee, YK; Seo, HS; Kim, KH; Ahn, JH; Lee, YM, IMAPS 2005 Proceedings, 2005

3
Enhanced low-temperature crystallization of amorphous Si films using AlCl3 vapor

Ahn, JH; Eom, Ji Hye; Ahn, Byung Tae, 2001 MRS Spring Meeting, v.685, pp.180 - 185, 2001-04-16

4
Organic-inorganic sol-gel hybrid materials for protein patterning

Park, Chan Beum; Bae, Byeong-Soo; Kim, WS; Jin, JH; Kim, MG; Ahn, JH, The 7th PacRim International Conference on Glass and Ceramics, 2007-11-13

5
SnO2 nanostructures synthesized on Co substrates

Kim, HW; Shim, SH; Hwang, HJ; Shim, JH; Cho, NH; Park, MK; Lee, Hyuck Mo; et al, IUMRS International Conference in Asia 2006, IUMRS-ICA 2006, v.124-126, no.PART 2, pp.1289 - 1292, 2006-09-10

6
The effect of electrolytes on the discharge properties of sulfur electrode for Li/S cells

Ryu, HS; Ahn, HJ; Kim, KW; Ahn, JH; Cho, KK; Nam, TH; Lee, Jeong Yong, 2004 Joint International Meeting - 206th Meeting of the Electrochemical Society/2004 Fall Meeting of the Electrochemical Society of Japan,, pp.336 -, 2004-10-03

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