Browse "MS-Conference Papers(학술회의논문)" by Title
Showing results 6241 to 6260 of 7321
| Thermochemical stability of IrO2 electrodes in direct liquid injection metalorganic chemical vapor deposition of Pb-based ferroelectric films 이원종, 대한금속재료학회 추계학술발표대회, pp.66 - 66, 2002-10-01 |
| Thermodynamic alloy design of lead-free solders and thermodynamic issues of lead-free soldering in electronic packaging Jeong, SW; Kim, JH; Lee, Hyuck Mo, 58th Congresso Anual da ABM (Associacao Brasileira de Metalurgia e Materiais), pp.842 - 849, 2003-07-21 |
| Thermodynamic Analysis of the Microstructural Change in Sn-rich Solders affected by their Interfacial Reaction with Cu or Ni(P) UBM Lee, Hyuck Mo, 38th CALPHAD, 2009-05-17 |
| Thermodynamic and Kinetic Approaches to Lithium Intercalation into Sol-gel Derived Li1-dMn2O4 Electrode 변수일, 한국전기화학회 1999년도 제3회 총회 및 추계학술발표회, pp.64 - 64, 1999 |
| Thermodynamic assessment of the Bi-Ni system and Phase Equilibria of the Sn-Bi-Ni System Lee, Hyuck Mo, 136th TMS Annual Meeting, 2007-02-25 |
| thermodynamic Consideration for Morphotropic Tetragonal and Rhombohedral Phase Boundary in PZT System 김호기, The Korean Ceramic Soc., Processding of the 4th symposium of on Electronic Ceramics, Seoul Univ., 1990 |
| Thermodynamic issues of lead-free soldering in electronic packaging Jeong, SW; Kim, JH; Lee, Hyuck Mo, Thermec 2003 Processing and Manufacturing of Advanced Materials, no.5, pp.4081 - 4086, 2003-07-07 |
| Thermodynamics of Chemical Vapor Deposition and Its Application to Diamind Deposition Yoon, Duk Yong, ibid., pp.905 - 912, 1995 |
| Thermodynamics-Aided Alloy Design of Sn-Bi-In-Zn Solder System Lee, Hyuck Mo; Yoon, SW; Soh, JR, International Conference on Modelling and Simulation in Metallurgical Engineering and Materials Science, pp.160 - 165, 1996 |
| Thermoelectric Properties of PbTe@C Nanocables Prepared via One-Step Hydrothermal Synthesis Yong, Seok-Min; Kim, Do-Kyung, Asian Thermophysical Properties Conference, 한국열물성학회, 2013-09-29 |
| Thermomechanical stress analysis of Multilayer PCBs consisting of metals and viscoelastic polymers Paik, Kyung-Wook; Lim, JH; Kim, JS; Earmme, YY, International Conference on Fracture & Strength of Solids 2000, pp.0 - 0, 2000-12-01 |
| Thick Film Technology-the Application in the Microelectronics 김호기, The Korean Ceramic Soc.Spring Meeting,KAIST, 1984 |
| Thickness dependence of spin Hall Magnetoresistance in metallic-ferromagnet/non-magnet structures Choi, Jong Guk; Park, Byong Guk, The 18th International Symposium on the Physics of Semiconductors and Applications, 한국물리학회, 2016-07-05 |
| THIN film cigs-based solar cells with an In-based buffer layer fabricated by chemical bath deposition Larina, Liudmila; Kim, Ki Hwan; Yoon, Kyung Hoon; Konagaim, Makoto; Ahn, Byung Tae, Proceddings of the 3rd World Conference on Photovoltaic Energy Conversion, pp.531 - 534, 2003-05-11 |
| Thin film integral capacitor fabricated on a polymer dielectric for high density interconnect (HDI) applications Paik, Kyung-Wook; Lu, Toh-Ming, Proceedings of the Spring Meeting on MRS, v.390, pp.33 - 38, 1995-04-17 |
| Thin film transistors fabricated with poly-Si films crystallized by microwave annealing Choi, Yong Woo; Lee, Jeong No; Jang, Tae Woong; Ahn, Byung Tae, Proceedings of the 1998 MRS Spring Symposium, pp.139 - 144, MRS, 1998-04-13 |
| Thin Plate Fabrication and Characterization of Carbon Fiber Textile Reinforced Al Matrix Composite using Liquid Pressing Process 홍순형; Lee, SK; Byun, JH, Conference on Mechanical Behaviors of Materials, pp.234 -, 2003 |
| Thiol-ene Reaction Derived Sol-Gel Hybrid Dielectric Layer for Organic Thin Film Transistors Bae, Byeong-Soo; Kim, JS; Kim, YH; Ko, JH, PRIME 2012, The Electrochemical Society, 2012-10 |
| Thiol-ene Reaction derived Sol-Gel Oligosiloxane Hybrid Material for Optical Application Bae, Byeong-Soo; Kim, Joon-Soo; Yang, SeungCheol; Park, Hyung-Jin, 2011 MRS Spring Meeting, MRS, 2011-04 |
| Thmperature Dependence of abnormal Growth of Faceted Grains in a Liquid Matrix Yoon, Duk Yong, ibid., pp.413 - 417, 1995 |
Discover
Type
- 12 Article
- 1 Book
- 7,308 Conference
Date issued
- 691 2020 - 2023
- 2,574 2010 - 2019
- 2,236 2000 - 2009
- 1,492 1990 - 1999
- 318 1980 - 1989