Thermodynamic alloy design of lead-free solders and thermodynamic issues of lead-free soldering in electronic packaging
- Issue Date
- 2003-07-21
- Language
- ENG
- Citation
58th Congresso Anual da ABM (Associacao Brasileira de Metalurgia e Materiais), pp.842 - 849
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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