| 5941 | The drastic changes in the electrical properties of doped hydrogenated amorphous silicon as a resistive layer material during vacuum packaging processes in field emission display Ha J.K.; Chung B.H.; Han S.Y.; Choi J.O.; Kim, Ho Gi, Proceedings of the 14th International Vacuum Microelectronics Conference, pp.217 - 218, 2001-08-12 |
| 5942 | The Dynamic Studies on Voids Formation during making in Silicon Wafer Bonding 강상원, 한국전자공학회, 합동학술발표회 논문집 제10호, 제1권, pp.219 -, 1992 |
| 5943 | The Effect fo Mo or Re Addition on the Liquid Phase Sintering of W Heavy Alloy Yoon, Duk Yong, ibid., pp.525 - 530, 1995 |
| 5944 | The effect of addition of Gd, La into YVO4:Eu3+ red phosphor Jeon, Duk Young; Kang, JH; Im, WB; Lee, DC; Kim, JY, 2003 International Meeting on Information Display, pp.1017 - 1020, 2003 |
| 5945 | The effect of additives on the precipitation behavior of Ag-Pd-In dental alloy 이진형, 대한금속재료학회, 2000 |
| 5946 | The Effect of Air Impurities on the PEMFC Performances Cho, Eun-Ae; Jang, JH.; Kim, YY.; Son, JH.; Lee, SY.; Kim, HJ.; Lim, TH.; et al, Fuel Cell Seminar, Fuel Cell Seminar, 2008-10-28 |
| 5947 | The Effect of Alumina powder filled Polyimide Adhesive on the Thermo-Mechanical Stress of Lead-On-Chip Package Paik, Kyung-Wook, 3rd Pan Pacific Microelectronics Sym., pp.429 - 434, 1998-02-01 |
| 5948 | The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji Hye; Lee, Tae Ik; Kim, Taek Soo; Paik, Kyung Wook, 66th Electronic Components and Technology Conference, pp.1583 - 1591, Electronic Components and Technology Conference, 2016-06-01 |
| 5949 | The effect of annealing on the discharge characteristics of Zr-V-Mn-Ni hydrogen storage alloy Lee, Jai Young, Japan-Korea Joint Symposium on Hydrogen Energy, pp.189 - 194, 1997 |
| 5950 | The effect of annealing on the discharge characteristics of ZrV0.7Mn0.5Ni0.2 Lee, Jai Young, International Symposium on Metal Hydrogen Systems : Fundamentals and Applications, 1998 |
| 5951 | The effect of BaCO3 on CuO formation in Cu-free synthesis of a screen-printed YBCO superconductor on Cu plate No, Kwangsoo; Kim, Young Ha; Kim, Sung Kwan; Jeon, Young Ah; Hong, Jong In; Kim, Yun Seok; Paik, Han Jong, International Conference on Electroceramics 2005 (ICE2005), v.0, no.0, pp.0 - 0, International Conference on Electroceramics 2005 (ICE2005), 2005-06-14 |
| 5952 | The effect of bonding conditions on the electrical properties of solder joints fabricated by mechanical caulking using reflowed Sn bumps Yang, JH; Kim, YH; Moon, JS; Lee, Won-Jong, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| 5953 | The effect of bottom electrode on the ferroelectric property of RF-magnetron sputtered BaTiO3 thin films Choi, Si-Kyung; Cho, YW, CIMTEC 2002, pp.953 - 960, 2002 |
| 5954 | The Effect of Buffer Layer on the Fabrication and Characteristics of Ferroelectric Thin Films No, Kwangsoo; Song, Han Wook; Lee, Joon Sung; Kim, Dae-Won; Kim, Kwang Ho; Sung, Hae-Hyun, MRS Fall Meeting, pp.471 - 476, MRS, 1997-01-01 |
| 5955 | The effect of casting method and heat treating condition on cold workability of high-Si steel 이진형, 대한금속재료학회, 2000 |
| 5956 | The effect of casting methods and heat treating conditions on segregation and formation of ordered phase 이진형, 대한금속재료학회, 2001 |
| 5957 | The effect of Cd and Sn on the fluidity and casting properties in high strength Al-Cu alloy 이진형, 대한금속재료학회, 2000 |
| 5958 | The effect of Cd-substitution site on sinterring behavior and electical properties in PB(Ni1/3Nb2/3)O3-PbTiO3 ceramics Kim, Ho Gi, ISOE '96, 1996-01-01 |
| 5959 | The Effect of Cell Spacings on Intercellular Segregation considering the Diffusion in Solid and Liquid Phase Zin-Hyoung Lee, The 5th Pacific Rim International Conference on Modeling of Casting and Solidification Processes, pp.20 - 23, 2002 |
| 5960 | The Effect of Coherency Strain on Alloy Formation: Migration of Liquid Films : in Diffusion in Solids : Recent Developments, ed. by M.A. Dayanada and G.E. Murch Yoon, Duk Yong, The Metall. Soc. AIME, pp.275 - 292, 1985 |
