Browse "MS-Conference Papers(학술회의논문)" by Title
Showing results 3161 to 3180 of 7321
| High Performance Silicon PIN Photodiode for Near-IR Spectral Range(2): Leakage Current and Photo-response Characteristics 노광수; 박건식; 박종문; 유성욱; 윤용선; 구진근; 김보우, 제13회 한국반도체학술대회, v.1, no.18, pp.241 - 243, 한국반도체학술대회, 2006-02-23 |
| High performance Silicon PIN Photodiode ofr Near-IR Spectral Range(1): Estimations of the Optical Depletion Width for the Best Responsivity and Response Time 노광수; 박건식; 박종문; 유성욱; 윤용선; 구진근; 김보우, 제13회 한국반도체학술대회, v.1, no.14, pp.233 - 243, 한국반도체학술대회, 2006-02-24 |
| High performance sol-gel processed fluorine zinc tin oxide thin film transistors Bae, Byeong-Soo; Jin, JungHo; Ko, Ji-Hoon; Yang, SeungCheol, International Conference on Materials for Advanced Technologies, 2011 6th ICMAT, 2011-06 |
| High performance transparent glass-fabric reinforced composite substrate film for flexible devices Bae, Byeong-Soo; Jin, JungHo; Ko, Ji-Hoon; Yang, SeungCheol, International Conference on Materials for Advanced Technologies, 2011 6th ICMAT, 2011-06 |
| High Photosensitive Inorganic-Organic Hybrid Materials for Direct Photo-Patterning of Microstructured Surfaces Bae, Byeong-Soo, The 5th International Meeting of Pacific Rim Ceramic Societies, 2003 |
| High Photosensitivity in Photo-Hybrimer for Direct Photo-Fabrication of Micro Optical Devices Using Interference Holography 배병수; 강동준; 김진기, 대한고분자학회, 대학고분자학회, 2005 |
| High power and fine pitch assembly using solder anisotropic conductive films (ACFs) combined with ultrasonic bonding technique Lee, K; Paik, Kyung-Wook, 60th Electronic Components and Technology Conference, ECTC 2010, pp.421 - 426, ECTC, 2010-06-01 |
| High power operation of non-biased optical bistable devices using multiple shallow quantum well pinip diodes Ahn, Byung Tae, The 1997 International Conference on Solid State Devices and Materials(SSDM97), pp.0 - 0, 1997-09-01 |
| High Precision Embedded Capacitor Films for Build-Up Substrates Applications 백경욱, 한국 마이크로 전자 및 패키징학회 2002년도 SMT PCB 기술세미나, pp.65 - 99, 한국 마이크로 전자 및 패키징학회, 2002-03 |
| High Productivity and Damage-free Ultrasonic Anisotropic Conductive Film (ACF) Bonding for Touch Screen Panel (TSP) Assemblies Kim, Seung-Ho; Kim, Young-Jae; Park, Ho Joon; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05 |
| High pulling rate defect-free crystals with axially asymmetric characteristics due to controlled melt convection Cho, HJ; Lee, BY; Lee, SH; Lee, Jeong Yong, High Purity Silicon 9 - 210th Electrochemical Society Meeting, pp.31 - 39, 2006-10-29 |
| High rate carbon coated LiNi0.5Mn1.5O4 as a positive electrode for Li-ion batteries Nisar, Umair; Jung, Young Hwa; Moon, San; Kim, Do Kyung, 2012년 한국전지학회 추계학술대회, 한국전지학회, 2012-10-19 |
| High Reliable Non-Conductive Adhesives for Flip Chip CSP Applications Yim, MJ; Hwang, JS; Kwon, WS; Jang, KW; Paik, Kyung-Wook, 2002 Electronic Components & Technology Conference , pp.1385 - 1389, 2002 Electronic Components & Technology Conference, 2002-05-28 |
| High Reliable Nong-Conductive Adhesives for Flip Chip Interconnections Kwon, WS; Jang, KW; Paik, Kyung-Wook, 3rd International Symposium on Electronic Materials and Packagings 2001, pp.34 - 38, 2001-11 |
| High Resolution Transmission Electron Microscopy of Partial States of Oxygen Order in YBa2CuO7-x Ahn, Byung Tae, MRS Symposium Proc., 183, pp.369 - 374, 1990 |
| High speed touch screen panels (TSPs) assembly using anisotropic conductive adhesives (ACAs) vertical ultrasonic bonding method Kim, SH; Lee, K; Paik, Kyung-Wook, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1964 - 1967, ECTC, 2010-06-01 |
| High Strain Rate Superplasticity in 2124 Al Alloy and SiC Reinforced 2124 Al Composite Hong, Soon-Hyung, pp.333 - 338, 2000-01-01 |
| High Strain Rate Superplasticity in SiCw/2024Al Metal Matrix Composite Hong, Soon-Hyung, pp.989 - 996, 1993-01-01 |
| High Strain-Rate Deformation Behavior of NiAl/Ni Micro-Laminated Composites Hong, Soon Hyung; Kim, HY; Kim, JY; Jeong, DS; Enoki, M, The Korean Society for Composite Materials, pp.237 - 240, 복합재료학회, 2004 |
| High Strength and Thermal Conductivity of Low Temperature Sintered Aluminum Nitride Ceramics with CaZrO3 Additive Lee, Hyun Min; Kim, Do-Kyung, Materials Science & Technology 2013, The Ameican Ceramic Society, Association for iron & steel, The Materials Information Society, The Minerals, Metals & Materials Society, 2013-10-28 |
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