High speed touch screen panels (TSPs) assembly using anisotropic conductive adhesives (ACAs) vertical ultrasonic bonding method
- Publisher
- ECTC
- Issue Date
- 2010-06-01
- Language
- English
- Citation
60th Electronic Components and Technology Conference, ECTC 2010, pp.1964 - 1967
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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