Browse "MS-Conference Papers(학술회의논문)" by Title
Showing results 2221 to 2240 of 7321
| Electrode characteristics of C14-type Zr-based Laves phase alloys Lee, Jai Young, Second Pacific Rim International conference on advanced materials and processing, 1995 |
| Electrode Characteristics of C14-type Zr-based Laves Phase Alloys Lee, Jai Young, International Symposium on Metal-Hydrogen Systems Fundamentals and Applications, 1994 |
| Electrodeposition of amorphous MSx anode as Na-ion batteries anodes with enhanced reversibility Kim, TaeHee; Shin, JaeWook; Lee, Hoin; Cho, Eun Ae, ACEPS-9, The Korean Electrochemical Society, 2017-08 |
| Electrodeposition of Co-P alloy calalysts and their hydrogen generation properties from hydrolysis of NaBH4 권혁상, 한국부식방식학회 추계학술대회, 한국부식방식학회, 2007-11 |
| Electrodeposition of Microporous Co-P catalysts and their hydrogen generation chracteristics in alkaine NaBH4 solution Kwon, Hyuk-Sang, 211th ECS Meeting, ECS, 2007-05 |
| Electrodeposition of pure Sn electrodes with various structures and their electrochemical performances for Na-ion batteries Kim, Tae Hee; Nam, Do Hwan; Hong, Kyung Sik; Sohn, Dongrak; Lim, Sung Jin; Kwon, Hyuk Sang; Cho, Eun Ae, 한국전기화학회 춘계총회 및 학술발표회, 한국전기화학회, 2016-04-08 |
| Electrodeposition of Rhenium from Molten Salt 문산; 김주형; 김도경, 2013년 한국재료학회 추계 학술발표대회 및 제 24회 신소재 심포지엄, 한국재료학회, 2013-11-08 |
| Electrodeposition of tungsten from ZnCl2-NaCl-KCl-WO3 melt and analysis on tungsten species in the melt Moon, San; Kim, Joo-Hyung; Kim, Do Kyung, 2013년 한국세라믹학회 춘계총회 및 연구발표회, 한국세라믹학회, 2013-04-18 |
| Electrodissolution Study of Al Thin Film with Microband Electrodes 변수일, Korean Corros. Sci. Soc., pp.10 - 10, 1992 |
| Electrogravimetric Study on the Lithium Transport through the Li1-dCoO2 Film Electrode Prepared by R.F. Magnetron Sputtering Pyun, Su Il, International Symposium on New Materials for Electrochemical Systems, 2001 |
| Electroless Ni Bumped Flip Chip Interconnection on an Organic Substrate using Anisotropic Conductive Adhesives/Films (ACAs/ACFs) Paik, Kyung-Wook, Int. Advanced Tech. Workshop on Flip Chip Technology, pp.0 - 0, 1999-03-01 |
| Electroless Ni Plating Solutions for Reproducible Black Pad Analyses Yu, Jin, IMAPS 2013, IMAPS 2013, 2013-10-01 |
| Electroless Ni-PUBM과 Sn-based 무연솔더의 계면반응에 미치는 Bi 합금원소의 영향 조문기; 전영두; 백경욱; 김중도; 김용남, 한국 마이크로 전자 및 패키징 학회 2003년도 추계 기술심포지움, 한국 마이크로 전자 및 패키징 학회, 2003-11-14 |
| Electroless Ni-PUBM과 Sn-based 무연솔더의 계면반응에 미치는 Bi 합금원소의 영향 (Effects of Bi in Sn-based Pb Free solder interfacial reaction and Electroless Ni-PUBM) 조문기; 전영두; 백경욱; 김중도; 김용남, 한국 마이크로 전자 및 패키징 학회-(IMAPS-Korea) 2003년도 추계 기술심포지움, pp.128 - 132, 한국마이크로전자 및 패키징학회, 2003-11-14 |
| Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure Nah, JW; Kim, JH; Paik, Kyung-Wook; Lee, HM, TMS 2004 133rd Annual Meeting & Exhibition, pp.294, 133rd TMS Annual Meeting, 2004-03 |
| Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure Nah, Jae-Woong; Kim, Jong Hoon; Lee, Hyuck-Mo; Paik, Kyung-Wook, 133rd TMS Annual Meeting, 133rd TMS Annual Meeting, 2004-03 |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging, EMAP 2006, 123, 2006-12-11 |
| Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, ECTC '07, pp.1472 - 1477, IEEE, 2007-05-29 |
| Electronic Artificial Tongue Biosenser based on Self-assembled Gustatory-neuronal Cells 구본일; Le, Kim Huyen Trang; 남윤성, 한국바이오칩학회 춘계학술대회, (사)한국바이오칩학회, 2019-05-15 |
| Electronic Conductivity Enhancement of LiMnPO4 as a Cathode Electrode for Lithium Rechargeable Battery Lim, Chek Hai; Lee, Hyun-Wook; Kim, Dong Jun; Kim, Do Kyung, Materials Science and Technology 2011 Conference and Exhibition, The American Ceramic Society, Association for Iron and Steel Technology, The Materials Informaion Society, The Minerals, Metals & Meterials Society, 2011-10-18 |
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