Electroless Ni Bumped Flip Chip Interconnection on an Organic Substrate using Anisotropic Conductive Adhesives/Films (ACAs/ACFs)
- Issue Date
- 1999-03-01
- Language
- ENG
- Citation
Int. Advanced Tech. Workshop on Flip Chip Technology, pp.0 - 0
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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