Browse "MS-Conference Papers(학술회의논문)" by Title
Showing results 2061 to 2080 of 7321
| Effects of temperature and coating speed to solution-sheared perovskite thin film Park, Steve; Lee, Hyeon Seok, The 4th International Conference on Active Materials and Soft Mechatronics, AMSM2019, The Korean Society for Composite Materials, 2019-10-16 |
| Effects of Tempering on the Stress-Corrosion Crack Propagation Behavior of 3.5 Ni-Cr Steels in 3.5 wt.% NaCl Solution 변수일, Korean Corros. Sci. Soc., pp.4 - 4, 1989 |
| Effects of Tempering Temperature and P Content on the Stress Corrosion Cracking of 3.5Ni-Cr Steel in 3.5wt.% NaCl Solution 변수일, Korean Corros. Sci. Soc., pp.15 - 15, 1988 |
| Effects of Tempering Temperature on the Stress-Corrosion Crack Propagation Behavior of 3.5Ni-Cr Steels in 3.5wt.% NaCl Solution Pyun, Su Il, Intern. Conf. on Evalution of Materials Performance in Severe Environments, pp.257 - 264, 1989 |
| Effects of texture on the electrochemical propertires of single grains on polycrystalline zinc Kwon, Hyuk-Sang, Asian-Pacific Corrosion Control Conference, 2001 |
| Effects of the addition of CF4, Cl2, and N2 to O2 ECR plasma on the etch rate, selectivity, and etched profile of RuO2 film Lee, EJ; Kim, JS; Kim, JW; Baik, KH; Lee, Won-Jong, Proceedings of the 1997 MRS Fall Symposium, v.493, pp.183 - 188, 1997-11-30 |
| Effects of the Adhesion Strength on the Bending Fatigue Behavior of Cu pattern laminated fabrics using B-stage Non-conductive Films (NCFs) Jung, Seung-Yoon; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.2302 - 2306, IEEE-CPMT, 2018-05-31 |
| Effects of the Anchoring Polymer Layer (APL) Materials on Conductive Particle Movements for Ultra-Fine Pitch Chip-on-Glass (COG) Interconnection Yoon, Dal Jin; Paik, Kyung-Wook, SID Symposium, Seminar, and Exhibition 2018, Display Week 2018, pp.1113 - 1116, John Wiley and Sons Inc, 2018-05 |
| Effects of the citrate-coated nanosized Ag pastes on joining reliable Cu-Cu joints for Current 3D ICs Zhang, Shuye; Duan, Xiaokang; Li, Zhenfeng; Xu, Jiaohao; Wang, Dayin; Zhang, Shang; He, Peng; et al, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), pp.1957 - 1962, IEEE, 2021-06 |
| Effects of the Creep Damage on the Creep-Fatigue Interaction in Lamellar Structured TiAl Alloy 남수우, Proc. of the 14th Conference on Mechanical Behaviors of Materials, pp.15 - 24, 2000 |
| Effects of the Curing properties and Viscosities of Non-Conductive Films (NCFs) on the Sn-Ag Solder Bump Joint Morphology and Reliability Lee, HanMin; Lee, Se Yong; Shin, SangMyung; Choi, TaeJin; Park, SooIn; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2278 - 2283, IEEE, 2019-05 |
| Effects of the field emission display panel sealing process on the cathodoluminescence properties of phosphor screen Park, ZM; Jeon, Duk Young; Jin, YW; Cha, SN; Kim, JM, 13th International Vaccum Microelectronics Conference, v.19, no.3, pp.999 - 1003, 2000-08-14 |
| Effects of the functional groups of non-conductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards Chung, CK; Kwon, WS; Park, JH; Lee, Soon-Bok; Paik, Kyung-Wook, International Symposium on Electronics Materials and Packaging, 2005, v.2005, pp.156 - 161, 2005-12-11 |
| Effects of the Hydrogen on the Electronic Property of the Passivating TiO2 Film 변수일, Korean Corros. Sci. Soc., pp.13 - 13, 1990 |
| Effects of the Materials Properties of Epoxy Molding Films (EMFs) on Fan-Out Packages (FOPs) Characteristics Shin, Sangmyung; Lee, Hanmin; Kim, JunMo; Lee, Tae-Ik; Kim, Taek-Soo; Kyung, Youjin; Jeong, Minsu; et al, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.1146 - 1151, IEEE, 2019-05 |
| Effects of the Minor Addition of Zn on Interfactial Reactions of Sn-Ag- Cu and Sn-Cu Solders On Various Cu Substrates during Thermal Aging Lee, Hyuck Mo, 136th TMS Annual Meeting, 2007-02-25 |
| Effects of the platelet structures on the melt textured growth YBCO superconductors Hong, I; Hwang, H; Han, YH; Han, SC; Sung, TH; No, Kwangsoo, 2002 Applied Superconductivity Conference, v.13, pp.3165 - 3168, 2002-08-05 |
| Effects of the polymer residues on via contact resistance after reactive ion etching Ko, HS; Nah, JW; Paik, Kyung-Wook; Park, Y, 20th North American Conference on Molecular Beam Epitaxy, v.20, no.3, pp.1000 - 1007, 2001-10-01 |
| Effects of the properties of Ni-P films on Black pad formation after the ENIG process Kim, Kyoungdoc; Yu, Jin, ICEP 2013, pp.676 - 679, ICEP 2013, 2013-04-12 |
| Effects of the resistivity and crystal orientation of the silicon PIN detector on the dark current and radiation response characteristics Park, KS; Park, JM; Yoon, YS; Koo, JG; Kim, BW; Yoon, CJ; No, Kwangsoo, IEEE Nuclear Science Symposium, Medical Imaging Conference and 15th International Workshop on Room-Temperature Semiconductor X- and Gamma-Ray Detectors, Special Focus Workshops, NSS/MIC/RTSD 2006, pp.1068 - 1072, 2006 IEEE Nuclear Science Symposium Conference Record, 2006-10-29 |
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