알루미나 혼합 폴리이미드 접착제의 물성변화가 LOC 패키지의 열응력에 미치는 영향The effect of physical property change of alumina filled polyimide adhesive on the thermal stress behavior of LOC package
- Advisors
- 백경욱researcher; Paik, Kyung-Wookresearcher
- Description
- 한국과학기술원 : 테크노경영대학원,
- Publisher
- 한국과학기술원
- Issue Date
- 1997
- Identifier
- 115717/325007 / 000953666
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 테크노경영대학원, 1997.2, [ vii, 47 p. ]
- Keywords
열응력; 알루미나; 폴리이미드; 리드프레임; Leadframe; LOC; Thermal stress; Alumina; Polyimide
- Appears in Collection
- KGSM-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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