마이크로 머신 소자(MEMS) 패키지의 열응력에 대한 연구A study on the thermo-mechanical stress of MEMS device packages
- Advisors
- 백경욱researcher; Paik, Kyung-Wookresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1998
- Identifier
- 133558/325007 / 000963549
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 1998.2, [ iii, 60 p. ]
- Keywords
패키지 응력; 접착; 열 응력; 마이크로 머신; 모의실험; FEM; Package stress; Adhesive; Thermal stress; MEMS
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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