(A) study on the polymer dielectric layer formation and metal/polymer via interconnection in MCM-D substrate fabricationMCM-D 기판 제조용 폴리머 절연층 형성과 금속/폴리머 비아 접속에 관한 연구
- Advisors
- Paik, Kyung-Wookresearcher; 백경욱researcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2001
- Identifier
- 165791/325007 / 000965024
- Language
- eng
- Description
학위논문(박사) - 한국과학기술원 : 재료공학과, 2001.2, [ vii, 83 p. ]
- Keywords
three dimensional packaging; O2 plasma RIE; polymer adhesion to ceramic; Multilayer MCM-D; aluminum chelate; 킬레이트; 3차원 패키징; 산소 플라즈마; 세라믹-폴리머 접착력; 다층 구조 기판
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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