EE-Journal Papers(저널논문)
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Recent Items
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1
Text-guided distillation learning to diversify video embeddings for text-video retrieval
Lee, Sangmin; Hyung-Il, Kim; Ro, Yong Man, Pattern Recognition, v.156, 2024-12
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CLOi-Mapper: Consistent,Lightweight, Robust, and Incremental Mapper With Embedded Systems for Commercial Robot Services
NOH, DONGKI; Lim, HyungTae; Eoh, Gyuho; Choi, Duckyu; Choi, Jeonsik; Lim, HyunJun; Baek, SeungMin; Myung, Hyun, IEEE ROBOTICS AND AUTOMATION LETTERS, v.9, no.9, pp.7541 - 7548, 2024-09
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3
Robust Pedestrian Detection via Constructing Versatile Pedestrian Knowledge Bank
Park, Sungjune; Kim, Hyunjun; Ro, Yong Man, Pattern Recognition, v.153, 2024-09
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Softening implantable bioelectronics: Material designs, applications, and future directions
Oh, Subin; Lee, Simok; Kim, Sung Woo; Kim, Choong Yeon; Jeong, Eun Young; Lee, Juhyun; Kwon, Do A; Jeong, Jae-Woong, Biosensors and Bioelectronics, v.258, pp.116328, 2024-08
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5
A Fully Integrated Multi-Phase Voltage Regulator With Flying-Capacitor-Based Inter-Inductor Current Self-Balancing Scheme and Charge-Recycling Gate Driver
Cho, Jeong-Hyun; Bae, Hong-Hyun; Lim, Gyu-Wan; Kong, Tae-Hwang; Yang, Jun-Hyeok; Kim, Hyun-Sik, IEEE Journal of Solid-State Circuits, v.59, no.8, pp.2529 - 2544, 2024-08
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6
Representative and Back-In-Time Sampling from Real-world Hypergraphs
Choe, Min Young; Yoo, Jaemin; Lee, Geon; Baek, Woonsung; Kang, U; Shin, Kijung, ACM TRANSACTIONS ON KNOWLEDGE DISCOVERY FROM DATA, v.18, no.6, 2024-07
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7
On the physical layer security of visible light communications empowered by gold nanoparticles
Han Geonho; Choi Hyuckjin; Kim Ryeong Myeong; Nam Ki Tae; Choi Junil; Tsiftsis Theodoros A., JOURNAL OF OPTICAL COMMUNICATIONS AND NETWORKING, v.16, no.7, pp.750 - 763, 2024-07
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8
Sub-rate sampled, non-integer fractionally spaced Volterra nonlinear equalizer for IM/DD systems
김재윤; 김훈, OPTICS EXPRESS, v.32, no.15, pp.26332 - 26341, 2024-07
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9
Maximizing discrimination capability of knowledge distillation with energy function
Kim, Seonghak; Ham, Gyeongdo; Lee, Suin; Jang, Donggon; Kim, Dae-Shik, KNOWLEDGE-BASED SYSTEMS, v.296, 2024-07
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10
Improvement of electrical and optoelectronic properties of ZnO thin films by plasma nitridation treatment
Kim, Minje; Baek, Jongsu; Kim, Sunjae; Bae, Joonyup; Cho, Byung-Jin; Kim, Jihyun; Hwang, Wan Sik, Optical Materials, 2024-07
Collection's Items (Sorted by Submit Date in Descending order): 14121 to 14140 of 14218
| A study of negative-bias temperature instability of SOI and body-tied FinFETs Lee, HJ; Lee, CH; Park, DG; Choi, Yang-Kyu, IEEE ELECTRON DEVICE LETTERS, v.26, no.5, pp.326 - 328, 2005-05 |
| A comprehensive modeling of dynamic negative-bias temperature instability in PMOS body-tied FinFETs Lee, H; Lee, CH; Park, D; Choi, Yang-Kyu, IEEE ELECTRON DEVICE LETTERS, v.27, no.4, pp.281 - 283, 2006-04 |
| Hybrid analytical Modeling method for split power bus in multilayered package Jeong, Y; Lu, ACW; Wai, LL; Fan, W; Lok, BK; Park, H; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.82 - 94, 2006-02 |
| Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards Kim, Joungho; Rotaru, MD; Baek, S; Park, J; Yer, MK, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.319 - 330, 2006-05 |
| Over GHz low-power RF clock distribution for a multiprocessor digital system Ryu W.; Wai A.L.C.; Wei F.; Lai W.L.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.1, pp.18 - 27, 2002-02 |
| System-on-package ultra-wideband transmitter using CMOS impulse generator Lee, Jun-Woo; Park, Young-Jin; Kim, Myung-Hoi; Yoon, Chang-Wook; Kim, Joung-Ho; Kim, Kwan-Ho, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.54, pp.1667 - 1674, 2006-04 |
| Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards Kim, Joungho; Lee H., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.4, pp.724 - 735, 2005-11 |
| Modeling and measurement of simultaneous switching noise coupling through signal via transition Park, J.; Kim, H.; Jeong, Y.; Kim, J.; Pak, J.S.; Kam, D.G.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.548 - 559, 2006-08 |
| Modeling and measurement of radiated field emission from a power/ground plane cavity edge excited by a through-hole signal via based on a balanced TLM and via coupling model Pak, Jun So; Kim, Hyungsoo; Lee, Junwoo; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.73 - 85, 2007-02 |
| Spread spectrum clock generator with delay cell array to reduce electromagnetic interference Kim, Joungho; Kam, DG; Jun, PJ, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.47, pp.908 - 920, 2005-11 |
| Quasi-3-D velocity saturation model for multiple-gate MOSFETs Han, Jin-Woo; Lee, Choong-Ho; Park, Donggun; Choi, Yang-Kyu, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.54, no.5, pp.1165 - 1170, 2007-05 |
| Power distribution networks for system-on-package: Status and challenges Swaminathan, M.; Kim, Joungho; Novak, I.; Libous, J.P., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.2, pp.286 - 300, 2004-05 |
| Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission Kam D.G.; Lee H.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.4, pp.590 - 596, 2004-11 |
| Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs Lee J.; Kim H.; Kim, Joungho; Rotaru M.D.; Iyer M.K., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.28, no.2, pp.298 - 309, 2005-05 |
| Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer Ahn, Seungyoung; Lee, Junho; Kim, Joungho; Ryu, Woonghwan; Kum, Byung-Hun; Choi, HS; Yoon, CK, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.26, pp.90 - 98, 2003-02 |
| Microwave frequency interconnection line model of a wafer level package Lee, J; Ryu, W; Kim, Joungho; Kim, N; Pak, J; Kim, JM, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, pp.356 - 364, 2002-08 |
| Unit cell approach to full-wave analysis of meander delay line using FDTD periodic structure modeling method Lee, H.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING , v.25, no.2, pp.215 - 222, 2002-05 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
| Characterization of picosecond electric-pulse propagation on CPW components by transient near-field mapping Lee, J; Yu, S; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, pp.459 - 466, 2002-08 |
| An efficient path-based equivalent circuit model for design, synthesis, and optimization of power distribution networks in multilayer printed circuit boards Kim Y.-J.; Yoon H.-S.; Lee S.; Moon G.; Wee J.-K.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.1, pp.97 - 106, 2004-02 |
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