DSpace at KOASAS: Softening implantable bioelectronics: Material designs, applications, and future directions

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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Journal Papers(저널논문)

Softening implantable bioelectronics: Material designs, applications, and future directions

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Oh, Subin / Lee, Simok / Kim, Sung Woo / Kim, Choong Yeon / Jeong, Eun Young / Lee, Juhyun / Kwon, Do A / Jeong, Jae-Woong researcher

Publisher: Elsevier BV

Issue Date: 2024-08

Language: English

Citation: Biosensors and Bioelectronics, v.258, pp.116328

ISSN: 0956-5663

DOI: 10.1016/j.bios.2024.116328

URI: http://hdl.handle.net/10203/319918

Appears in Collection: EE-Journal Papers(저널논문)

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