Lee, Sangmin; Hyung-Il, Kim; Ro, Yong Man, Pattern Recognition, v.156, 2024-12
NOH, DONGKI; Lim, HyungTae; Eoh, Gyuho; Choi, Duckyu; Choi, Jeonsik; Lim, HyunJun; Baek, SeungMin; Myung, Hyun, IEEE ROBOTICS AND AUTOMATION LETTERS, v.9, no.9, pp.7541 - 7548, 2024-09
Park, Sungjune; Kim, Hyunjun; Ro, Yong Man, Pattern Recognition, v.153, 2024-09
Oh, Subin; Lee, Simok; Kim, Sung Woo; Kim, Choong Yeon; Jeong, Eun Young; Lee, Juhyun; Kwon, Do A; Jeong, Jae-Woong, Biosensors and Bioelectronics, v.258, pp.116328, 2024-08
Cho, Jeong-Hyun; Bae, Hong-Hyun; Lim, Gyu-Wan; Kong, Tae-Hwang; Yang, Jun-Hyeok; Kim, Hyun-Sik, IEEE Journal of Solid-State Circuits, v.59, no.8, pp.2529 - 2544, 2024-08
Choe, Min Young; Yoo, Jaemin; Lee, Geon; Baek, Woonsung; Kang, U; Shin, Kijung, ACM TRANSACTIONS ON KNOWLEDGE DISCOVERY FROM DATA, v.18, no.6, 2024-07
Han Geonho; Choi Hyuckjin; Kim Ryeong Myeong; Nam Ki Tae; Choi Junil; Tsiftsis Theodoros A., JOURNAL OF OPTICAL COMMUNICATIONS AND NETWORKING, v.16, no.7, pp.750 - 763, 2024-07
김재윤; 김훈, OPTICS EXPRESS, v.32, no.15, pp.26332 - 26341, 2024-07
Kim, Seonghak; Ham, Gyeongdo; Lee, Suin; Jang, Donggon; Kim, Dae-Shik, KNOWLEDGE-BASED SYSTEMS, v.296, 2024-07
Kim, Minje; Baek, Jongsu; Kim, Sunjae; Bae, Joonyup; Cho, Byung-Jin; Kim, Jihyun; Hwang, Wan Sik, Optical Materials, 2024-07
K- and Q-bands CMOS frequency sources with X-band quadrature VCO Ko, S; Kim, JG; Song, T; Yoon, E; Hong, Songcheol, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.53, no.9, pp.2789 - 2800, 2005-09 |
Matrix-stripe-cache-based contiguity transform for fragmented writes in RAID-5 Baek, SH; Park, Kyu Ho, IEEE TRANSACTIONS ON COMPUTERS, v.56, pp.1040 - 1054, 2007-08 |
Impact of interfacial layer control using Gd2O3 in HfO2 gate dielectric on GaAs Dalapati, Goutam Kumar; Tong, Yi; Loh, Wei Yip; Mun, Hoe Keat; Cho, Byung Jin, APPLIED PHYSICS LETTERS, v.90, no.18, 2007-04 |
A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps Chu, KM; Lee, JS; Cho, HS; Park, HyoHoon; Jeon, DY, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.27, no.4, pp.246 - 253, 2004-10 |
Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02 |
Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications Chu, K.-M.; Choi, J.-H.; Lee, J.-S.; Cho, H.S.; Park, SeongOok; Park, HyoHoon; Jeon, D.Y., IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.409 - 414, 2006-08 |
The enhancement of Q factor in RPCVD SiGe varactors by the structural modification of the base-collector junction Mheen, B; Suh, D; Kim, SH; Shim, KH; Kang, JY; Hong, Songcheol, IEEE ELECTRON DEVICE LETTERS, v.24, no.4, pp.239 - 241, 2003-04 |
Effect of the dot size distribution on quantum dot infrared photoresponse and temperature-dependent dark current Kang, Yong Hoon; Park, Jinsung; Lee, Uk Hyun; Hong, Songcheol, APPLIED PHYSICS LETTERS, v.82, no.7, pp.1099 - 1101, 2003-02 |
Fully integrated low phase-noise VCOs with on-chip MEMS inductors Park, EC; Choi, YS; Yoon, JB; Hong, Songcheol; Yoon, E, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.51, no.1, pp.289 - 296, 2003-01 |
A K-Band InGaP/GaAs HBT balanced MMIC VCO Kim, JG; Baek, DH; Jeon, S; Park, JW; Hong, Songcheol, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.13, no.11, pp.478 - 480, 2003-11 |
A dual-band (13/22-GHz) VCO based on resonant mode switching Baek, D; Kim, J; Hong, Songcheol, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.13, no.10, pp.443 - 445, 2003-10 |
8-GHz CMOS quadrature VCO using transformer-based LC tank Baek, D; Song, T; Yoon, E; Hong, Songcheol, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.13, no.10, pp.446 - 448, 2003-10 |
A nonquasi-static table-based small-signal model of heterojunction bipolar transistor Ko, Sangsoo; Koh, Kyungmin; Park, Hyun-Min; Hong, Songcheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.49, no.10, pp.1681 - 1686, 2002-10 |
Thermal characteristics of InGaP/GaAs HBT ballasted with extended ledge Jeon, S; Park, HM; Hong, Songcheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.48, no.10, pp.2442 - 2445, 2001-10 |
A spline large-signal FET model based on bias-dependent pulsed I-V measurement Koh, K; Park, HM; Hong, Songcheol, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.50, no.11, pp.2598 - 2603, 2002-11 |
Infrared absorption of an In0.2Ga0.8As/GaAs quantum-well infrared photodetector employing a p-n-p camel diode structure Son, Heesoo; Park, Jinsung; Hong, Songcheol; Jo, SJ; Song, JI, APPLIED PHYSICS LETTERS, v.79, no.4, pp.455 - 457, 2001-07 |
A predistortion linearizer using envelope-feedback technique with simplified carrier cancellation scheme for class-A and class-AB power amplifiers Park, HM; Baek, DH; Jeon, KI; Hong, Songcheol, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.48, no.6, pp.898 - 904, 2000-06 |
Room temperature far infrared (8 similar to 10 mu m) photodetectors using self-assembled InAs quantum dots with high detectivity Kim, JW; Oh, JE; Hong, Songcheol; Park, CH; Yoo, TK, IEEE ELECTRON DEVICE LETTERS, v.21, no.7, pp.329 - 331, 2000-07 |
A novel temperature-dependent large-signal model of heterojunction bipolar transistor with a unified approach for self-heating and ambient temperature effects Park, HM; Hong, Songcheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.49, no.12, pp.2099 - 2106, 2002-12 |
L/M-fold image resizing in block-DCT domain using symmetric convolution Park, HyunWook; Park, Y; Oh, SK, IEEE TRANSACTIONS ON IMAGE PROCESSING, v.12, pp.1016 - 1034, 2003-09 |
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