Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구A study on the thermal deformations of wafer-level CSP assembly under power cycling
- Advisors
- 이순복researcher; Lee, Soon-Bokresearcher
- Description
- 한국과학기술원 : 기계공학전공,
- Publisher
- 한국과학기술원
- Issue Date
- 2001
- Identifier
- 165446/325007 / 000993518
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 기계공학전공, 2001.2, [ v, 71 p. ]
- Keywords
전자 패키지; 열변형; 웨이퍼 레벨; 파워 사이클; 모아레; thermal deformation; chip scale; CSP; wafer-level; power cycling
- Appears in Collection
- ME-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.