Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구A study on the thermal deformations of wafer-level CSP assembly under power cycling
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이순복 | - |
| dc.contributor.advisor | Lee, Soon-Bok | - |
| dc.contributor.author | 조만석 | - |
| dc.contributor.author | Cho, Man-Seok | - |
| dc.date.accessioned | 2011-12-14T06:37:01Z | - |
| dc.date.available | 2011-12-14T06:37:01Z | - |
| dc.date.issued | 2001 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=165446&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/45223 | - |
| dc.description | 학위논문(석사) - 한국과학기술원 : 기계공학전공, 2001.2, [ v, 71 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | 전자 패키지 | - |
| dc.subject | 열변형 | - |
| dc.subject | 웨이퍼 레벨 | - |
| dc.subject | 파워 사이클 | - |
| dc.subject | 모아레 | - |
| dc.subject | thermal deformation | - |
| dc.subject | chip scale | - |
| dc.subject | CSP | - |
| dc.subject | wafer-level | - |
| dc.subject | power cycling | - |
| dc.title | Power cycling하에서의 웨이퍼 레벨 CSP assembly의 열변형에 관한 연구 | - |
| dc.title.alternative | A study on the thermal deformations of wafer-level CSP assembly under power cycling | - |
| dc.type | Thesis(Master) | - |
| dc.identifier.CNRN | 165446/325007 | - |
| dc.description.department | 한국과학기술원 : 기계공학전공, | - |
| dc.identifier.uid | 000993518 | - |
| dc.contributor.localauthor | 조만석 | - |
| dc.contributor.localauthor | Cho, Man-Seok | - |
- Appears in Collection
- ME-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.