Results 291-300 of 307 (Search time: 0.016 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Innovative 5-m-Off-Distance Inductive Power Transfer Systems With Optimally Shaped Dipole Coils Park, Changbyung; Lee, Sungwoo; Cho, Gyu-Hyeong; Rim, Chuntaek, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.30, no.2, pp.817 - 827, 2015-02 | |
Energy-Scalable 4KB LDPC Decoding Architecture for NAND-Flash-Based Storage Systems Lee, Youngjoo; Jung, Jaehwan; Park, In-Cheol, IEICE TRANSACTIONS ON ELECTRONICS, v.E99C, no.2, pp.293 - 301, 2016-02 | |
Polypyrrole/Agarose Hydrogel-Based Bladder Volume Sensor with a Resistor Ladder Structure Kim, Mi Kyung; Lee, Sungwoo; Yoon, Inug; Kook, Geon; Jung, Yeon Su; Bawazir, Sarah S. M.; Stefanini, Cesare; Lee, Hyunjoo Jenny, SENSORS, v.18, no.2288, 2018-07 | |
Improving the Light-Load Regulation Capability of LLC Series Resonant Converter Using Impedance Analysis Yeon, Cheol O; Kim, Jong-Woo; Park, Moo-Hyun; Lee, Il-Oun; Moon, Gun-Woo, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.32, no.9, pp.7056 - 7067, 2017-09 | |
Calcium-modified silk as a biocompatible and strong adhesive for epidermal electronics Seo, Ji Won; Kim, Hyojung; Kim, KyuHan; Choi, Siyoung Q.; Lee, Hyunjoo Jenny, ADVANCED FUNCTIONAL MATERIALS, v.28, no.36, 2018-09 | |
Ferrite-Cored Patch Antenna With Suppressed Harmonic Radiation Lee, Woncheol; Hong, Yang-Ki; Choi, Minyeong; Won, Hoyun; Lee, Jaejin; Park, Seong-Ook; Bae, Seok; Yoon, Hwan-Sik, IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, v.66, no.6, pp.3154 - 3159, 2018-06 | |
Fast CU Splitting and Pruning for Suboptimal CU Partitioning in HEVC Intra Coding Cho, Seunghyun; Kim, MunChurl, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGY, v.23, no.9, pp.1555 - 1564, 2013-09 | |
A Modular Implementation Scheme for Nonsingleton Type-2 Fuzzy Logic Systems With Input Uncertainties Zaheer, Sheir Afgen; Choi, Seung-Hwan; Jung, Chang-Young; Kim, Jong-Hwan, IEEE-ASME TRANSACTIONS ON MECHATRONICS, v.20, no.6, pp.3182 - 3193, 2015-12 | |
Runtime Thermal Management for 3-D Chip-Multiprocessors With Hybrid SRAM/MRAM L2 Cache Lee, Seung Han; Kang, Kyungsu; Kyung, Chong-Min, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.23, no.3, pp.520 - 533, 2015-03 | |
High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoung; Kim, Jonghoon; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07 |
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