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A three-dimensional stacked-chip star-wiring interconnection for a digital noise-free and low-jitter I/O clock distribution network Ryu, C; Chung, D; Lee, C; Kim, Joungho; Bae, K; Yu, J; Lee, S, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.651 - 653, 2006-12 |
Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array Kam, DG; Kim, Joungho; Yu, J; Choi, H; Bae, K; Lee, C, IEEE DESIGN & TEST OF COMPUTERS, v.23, pp.212 - 219, 2006-05 |
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