Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array
- Publisher
- IEEE COMPUTER SOC
- Issue Date
- 2006-05
- Language
- English
- Article Type
- Article
- Citation
IEEE DESIGN & TEST OF COMPUTERS, v.23, pp.212 - 219
- ISSN
- 0740-7475
- Appears in Collection
- EE-Journal Papers(저널논문)
- Files in This Item
- 000237777800006.pdf(1.72 MB)Download
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