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EE-Conference Papers(학술회의논문)

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Collection's Items (Sorted by Submit Date in Descending order): 22721 to 22740 of 22906

22721
Batch Fabrication of Nanopillars for Autonomous Nanofluidic SERS Arrays

Choi, Yang-Kyu; Pio, Michael S.; Kwon, Sunghoon; Lee, Luke P., Materials Research Society, v.729, pp.179 - 184, Materials Research Society, 2002-04-01

22722
Chip-package co-design of power distribution network for system-in-package applications

Kim, G.; Kam, D.G.; Chung, D.; Kim, Joungho, 6th Electronics Packaging Technology Conference, EPTC 2004, pp.499 - 501, IEEE, 2005-12-08

22723
Noise generation, coupling, isolation, and EM raidaiton in high-speed package and PCB

Kim, Joungho; Pak, J.; Park, J.; Kim, H., IEEE International Symposium on Circuits and Systems 2005, ISCAS 2005, pp.5766 - 5769, IEEE, 2005-05-23

22724
Chip-Package Hybrid Clock Distribution Network and DLL for Low Jitter Clock Delivery

Chung, Daehyun; Ryu, Chunghyun; Kim, Hyungsoo; Lee, Choonheung; Kim, Jinhan; Bae, Kicheol; Yu, Jiheon; et al, Solid-state circuits, IEEE Journal of, vol.41. pp. 274-286, 2006-01

22725
Sub-20nm CMOS FinFET Technologies

Choi, Yang-Kyu; Lindert, Nick; Xuan, Peiqi; Tang, Stephen; Ha,Daewon; Anderson, Erik; King, Tsu-Jae; et al, IEEE, pp.421 - 424, IEEE, 2001-12

22726
Accurate Measurement of Power/Ground Impedance with Embedded Film Capacitor using Two-port Self-Impedance Measurement Technique

Kim, Hyungsoo; Jeong, Youchul; Park, Joungbae; Lee, SeokKyu; Hong, JongKuk; Hong, Youngsoo; Kim, Joungho, IEEE 5th Electronics Packaging Technology Conference, pp.51 - 54, IEEE, 2003-12-10

22727
Analytical Model of Power/Ground Noise Coupling to Signal Traces in High-speed Multi-Layer Packages or Boards

Kim, Jingook; Rotaru, Mihai Dragos; Lee, Junwoo; Park, Jongbae; Alexander, Popov; layer, Mahadevan K.; Kim, Joungho, 5th IEEE Electronics Packaging Technology Conference, pp.45 - 50, IEEE, 2003-12

22728
FinFET Process Refinements for Improved Mobility and Gate Work Function Engineering

Choi, Yang-Kyu; Chang, Leland; Ranade, Pushkar; Lee, Jeong-Soo; Ha, Daewon; Balasubramanian, Sriram; Agarwal, Aditya; et al, IEEE IEDM Technical Digest, pp.259 - 262, IEEE, 2002-12

22729
Analysis of coupling suppression methods on split power/ground planes using embedded capacitor in multi-layered package

Jeong, Y.; Lu, A.C.W.; Wai, L.L.; Fan, W.; Lok, B.K.; Kim, Joungho, 2004 Proceedings - 54th Electronic Components and Technology Conference, pp.575 - 580, IEEE, 2004-06-01

22730
Tunable Work Function Molybdenum Gate Technology for FDSOI-CMOS

Choi, Yang-Kyu; Ranade, Pushkar; Ha, Daewon; Agrwal, Aditya; Ameen, Michae; King, Tsu-Jae, IEEE, pp.363 - 366, IEEE, 2002-12

22731
System-on-Package ultra wideband transmitter with integrated bandpass filter and broad band planar antenna

Kim, M.; Lee, J.; Park, Y.-J.; Kim, Joungho, 55th Electronic Components and Technology Conference, ECTC, pp.541 - 544, IEEE, 2005-05-31

22732
Sub-50nm FinFET : PMOS

Choi, Yang-Kyu; Huang, Xuejue; Lee, Wen-Chin; Kuo, Charles; Hisamoto, Digh; Chang, Leland; Kedzierski, Jakub; et al, IEDM Technical Digest, pp.67 - 70, IEEE, 1999-12

22733
Ultra-thin Body SOI MOSFET for Deep-Sub-Tenth Micron Era

Choi, Yang-Kyu; Asano, Kazuya; Lindert, Nick; Subramanian, Vivek; King, Tsu-Jae; Bokor, Jeffrey; Hu, Chenming, IEEE, pp.919 - 921, IEEE, 1999-12

22734
Reduction of Direct- Tunneling Gate Leakage Current in Double-Gate and Ultra-Thin Body MOSFETs

Choi, Yang-Kyu; Chang, Leland; Yang, Kevin J.; Yeo, Tee-Chia; King, Tsu-Jae; Hu, Chenming, IEEE, pp.99 - 102, IEEE, 2001-12

22735
Design of LTCC-based ultra-wideband transmitter SiP using CMOS impulse generator

Yoon, C.; Lee, J.; Kim, M.; Park, Y.; Park, H.; Lee, H.; Kim, Joungho, 8th Electronics Packaging Technology Conference, EPTC 2006, pp.85 - 89, IEEE, 2006-12-06

22736
Improved noise isolation design of UHF mobile radio frequency identification reader system in package

Shim, Y.; Park, J.; Kim, Y.; Koo, K.; Kim, Joungho, 2006 8th Electronics Packaging Technology Conference, EPTC, pp.866 - 870, IEEE, 2006-12-06

22737
TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications

Kim, G.; Kam, D.G.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.657 - 662, IEEE, 2006-08-14

22738
Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design

Park, H.; Kim, H.; Kam, D.G.; Kim, Joungho, 55th Electronic Components and Technology Conference, ECTC, pp.727 - 731, IEEE, 2005-05-31

22739
Design and analysis of improved multi-module memory bus using Wilkinson power divider

Kim, J.; Song, E.; Kim, J.; Kim, Joungho; Sung, M.; Kim, J.; So, B., IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.642 - 645, IEEE, 2006-08-14

22740
Compensation of undesired channel effects by frequency domain optimization of pre-emphasis filter for over gbps signaling

Kim, J.; Lee, J.; Song, E.; Jo, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.721 - 726, IEEE, 2006-08-14

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