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EE-Conference Papers(학술회의논문)

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Collection's Items (Sorted by Submit Date in Descending order): 21741 to 21760 of 22914

21741
Reduced complexity sliding window BCJR decoding algorithms for turbo codes

Gwak, Jihye; Shin, Sooyoung Kim; Kim, Hyung-Myung, 7th IMA International Conference on Cryptography and Coding, 1999, pp.179 - 184, Springer Verlag (Germany), 1999-12

21742
IEEE 1516 HLA/RTI 표준을 만족하는 데이터 분산 관리 모듈의 설계 및 구현

안, 정현; 홍, 정희; 김, 탁곤; Ahn, Jung Hyun; Hong, Jeong Hee; Kim, Tag Gon, 한국 시뮬레이션 학회 논문지, Vol.17, No.2, pp.21-29, 2008-07-06

21743
A design and tool reuse methodology for rapid prototyping of application specific instruction set processors

Kim, Tag-Gon; Kim, Young Geol, IEEE RSP-99, pp.46 - 51, IEEE, 1999-06

21744
Embedding Simulation Modelling for Developing High Autonomy Systems

Kim, Tag-Gon; Chung, Minsun, 2nd Conference on AI, Simulation and Planning in high Autonomy Systems, 1991, pp.195 - 202, IEEE, 1991-04

21745
Efficient Power Saving Mechanism Considering Unavailability Interval in the IEEE 802.16e Systems

권상욱; 조동호, 한국통신학회 하계종합학술발표회, 2009, pp.1800 - 1801, 한국통신학회, 2009-06

21746
Analysis of the effect of AC noise on DC bias of VGA for UHF RFID using chip-package co-modeling and simulation

Lee, H.; Shim, Y.; Park, H.; Ryu, C.; Yoon, C.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.591 - 594, IEEE, 2007-12-12

21747
Noise figure degradation analysis of power/ground noise on 900MHz LNA for UHF RFID

Koo, K.; Park, H.; Shim, Y.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.416 - 420, IEEE, 2007-12-12

21748
Wideband low power distribution network impedance of high chip density package using 3-D stacked through silicon vias

Pak, J.S.; Ryu, C.; Kim, J.; Shim, Y.; Kim, G.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.351 - 354, IEEE, 2008-05-19

21749
Modeling and verification to analyze effect of power/ground noises on CMOS feedback operational amplifier

Shim, Y.; Park, J.; Shim, J.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 7, IEEE, 2007-07-09

21750
An adaptive on-chip ESR controller scheme in power distribution network for simultaneous switching noise reduction

Shim, Jongjoo; Shin, Minchul; Kim, Hyungsoo; Kim, Joungho, IEEE Conference on Electrical Performance of Electronic Packaging, pp.169 - 172, IEEE, 2008-11-18

21751
Networks-on-chip and networks-in-package for high-performance SoC platforms

Lee, K.; Lee, S.-J.; Kim, D.; Kim, K.; Kim, G.; Kim, Joungho; Yoo, Hoi-Jun, 1st IEEE Asian Solid-State Circuits Conference, ASSCC 2005, pp.485 - 488, IEEE, 2005-11-01

21752
A new neighbor discovery scheme based on spatial correlation of wireless channel

Lee, Woong-Sup; Cho, Dong-Ho, VTC Spring 2009 - IEEE 69th Vehicular Technology Conference, pp.1 - 5, IEEE, 2009-04-26

21753
An efficient and fast mode decision method for inter slice of H.264/AVC

Lee, J.Y.; Jun, D.; Park, HyunWook, 2009 IEEE International Conference on Image Processing, ICIP 2009, pp.3405 - 3408, IEEE, 2009-11-07

21754
An object tracking method using particle filter and scale space model

Heo, P.; Park, S.-J.; Jin, S.-H.; Yeou, B.Y.; Park, HyunWook, 2009 IEEE International Conference on Image Processing, ICIP 2009, pp.4081 - 4084, IEEE, 2009-11-07

21755
Efficient Camera Motion Characterization for MPEG Video Indexing

Kim, Jae-Gon; Chang, Hyun Sung; Kim, Jinwoong; Kim, Hyung-Myung, IEEE Int'l Conf. for Multimedia and Expo. (ICMC) 2000, v.2, no.0, pp.1171 - 1174, 2000-07-01

21756
Modeling of Chip-Package-PCB Hierarchical Power Distribution Network based on Segmentation Method

Kim, Jaemin; Shim, Jongjoo; Pak, Junso; Kim, Joungho, Electrical Design of Advanced Packaging and Systems Symposium, 2008. EDAPS 2008., pp.85 - 88, IEEE, 2008-12-11

21757
Vertical electromagnetic bandgap structure for noise suppression in single-ended and differential signaling on a multi-layer backplane board

Hwang, C; Jongbae P.; Jaemin K.; Kyoungchoul K.; Kim, Joungho, 20th International Zurich Symposium on Electromagnetic Compatibility, EMC Zurich 2009, pp.197 - 200, IEEE, 2009-01-12

21758
Analysis of the effect of digital power ground noise on active balun in UHF RTID SiP

Park, J.; Ryu, C.; Yoon, C.; Koo, K.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.586 - 590, IEEE, 2007-12-12

21759
Electrical characterization of Trough Silicon Via (TSV) depending on structural and material parameters based on 3D full wave simulation

Pak, J.S.; Ryu, C.; Kim, Joungho, International Conference on Electronic Materials and Packaging, EMAP 2007, IEEE, 2007-11-19

21760
Mode-impedance method for modeling and analysis of crosstalk in differential meander delay lines

Kim, G.; Kim, J.; Lee, S.; Kim, J.; Kim, Joungho, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.93 - 96, IEEE, 2008-12-10

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