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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; Choi, Sumin; Kim, Dong-Hyun; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 | |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 | |
| Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; Watanabee, Atom; Raj, Pulugurtha Markondeya; Sundaram, Venky; Tummala, Rao, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15 | |
| Eye-width and Eye-height Estimation Method based on Artificial Neural Network (ANN) for USB 3.0 Lho, Daehwan; Park, Junyong; Park, Hyunwook; Kang, Hyungmin; Park, Shinyoung; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.209 - 211, IEEE, 2018-10-15 | |
| Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method Park, Hyunwook; Park, Junyong; Kim, Subin; Lho, Daehwan; Park, Shinyoung; Park, Gapyeol; Cho, Kyungjun; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.213 - 215, IEEE, 2018-10-15 | |
| A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM) Son, Keeyoung; Kim, Subin; Park, Hyunwook; Kim, Seongguk; Kim, Keunwoo; Park, Shinyoung; Sim, Boogyo; Jeong, Seungtaek; Park, Gapyeol; Kim, Joungho, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 | |
| Design, simulation and measurement of a flexible voltage-controlled oscillator (VCO) chip with bending radius Jeong, Seungtaek; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Park, Hyunwook; Kim, Subin; Kim, Youngwoo; Son, Keeyeong; Kim, Joungho, IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), IEEE, 2020-10 | |
| Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling Kim, Keunwoo; Lho, Daehwan; Park, Hyunwook; Son, Keeyoung; Kim, Seongguk; Park, Shinyoung; Sim, Boogyo; Kim, Subin; Kim, Joungho, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 | |
| Reinforcement Learning-based Auto-router considering Signal Integrity Kim, Minsu; Park, Hyunwook; Kim, Seongguk; Son, Keeyoung; Kim, Subin; Son, Kyunjune; Choi, Seonguk; Park, Gapyeol; Kim, Joungho, 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020, IEEE, 2020-10 | |
| A Processing-In-Memory on High Bandwidth Memory (PIM-HBM): Impact of interconnect Channels on System Performance in 2.5D/3D IC Park, Hyunwook; Kim, Joungho; Shin, TaeIn; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Park, Joonsang, DesignCon 2022, IEEE, 2022-04-05 |