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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A Delay Line Circuit Design For Crosstalk Minimization Using Genetic Algorithm Kim, Joungho; Chung, Chaeho; Lee, Soobum; Kwak, Byungman; Kim, Gawon, China-Japan-Korea Joint Symposium on Optimization of Structural and Mechanical Systems, pp.551 - 556, 2006 | |
| High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package Kim, Joungho; Ryu, Chunghyun; Chung, Daehyun; Lee, Junho; Lee, Kwangyong; Oh, Taesung, IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging, pp.151 - 154, IEEE, 2005-10 | |
| An evaluation of differential impedance in PCBs using two single-ended probes only Kam, D.G.; Lee, H.; Ryu, W.; Kim, J.; Park, B.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.169 - 171, IEEE, 2002-05-12 | |
| Applications of Terahertz Electronics Kim, Joungho, 1st Asian Conference on Ultrafast Phenomena, 2000-02-28 | |
| Network-on-Chip and Network-in-Package for High-Performance SoC Kim, Joungho; Lee, Kangmin; Lee, Se-Joong; Kim, Donghyun; Kim, Kwanho; Kim, Gawon; Yoo, Hoi-Jun, IEEE 1st Asian-Solid State Circuits Conference, pp.485 - 488, 2005-11 | |
| Improved Noise Isolation Design of UHF Mobile RFID Reader SiP Kim, Joungho; Shim, Yujeong, EPTC, 2006 | |
| Via: A Source of Simultaneous Switching Noise Generation, Coupling, and Edge Radiation in High-speed Multi-layer Digital PCB Kim, Joungho; Park, Jongbae; Pak, Jun So; Kim, Hyungsoo, 2004 Korea-Japan Joint Conference on AP/EMC/EMT (KJJC), pp.22 - 23, 2004-11 | |
| Circuital Approach to Evaluate Shielding Effectiveness of Rectangular Enclosures with Apertures on Multiple Sides Kim, Joungho; Shim, Jongjoo; Kam, Dong Gun; Kwon, Jong-Hwa, International Symposium on Electromagnetic Compatibility (EMC Europe), pp.295 - 300, 2004 | |
| Balanced TLM and Coupling Model for Analysis of Power/Ground Resonance, Noise Coupling, and Edge Radiation Kim, Joungho; Pak, Jun So; Lee, Jongbae; Kim, Hyungsoo; Lee, H.J; Choi, C.S, Electromagnetic Compatibility Conference, pp.505 - 508, 2004 | |
| Compensation of BSD and device input capacitance by using embedded inductor on PCB substrate for 3 Gbps SerDes applications Ahn, S.; Baek, S.; Lee, J.; Kim, Joungho, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.499 - 504, 2004-08-09 |
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