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Results 1-10 of 15 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package Kim, Joungho; Ryu, Chunghyun; Chung, Daehyun; Lee, Junho; Lee, Kwangyong; Oh, Taesung, IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging, pp.151 - 154, IEEE, 2005-10 | |
| Network-on-Chip and Network-in-Package for High-Performance SoC Kim, Joungho; Lee, Kangmin; Lee, Se-Joong; Kim, Donghyun; Kim, Kwanho; Kim, Gawon; Yoo, Hoi-Jun, IEEE 1st Asian-Solid State Circuits Conference, pp.485 - 488, 2005-11 | |
| A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery Chung, D.; Ryu, C.; Kim, H.; Lee, C.; Kim, J.; Kim, J.; Bae, K.; Yu, J.; Lee, S.; Yoo, H.; Kim, Joungho, 2005 IEEE International Solid-State Circuits Conference, ISSCC, v.48, pp.514 - 614, 2005-02-06 | |
| High frequency electrical circuit model of chip-to-chip vertical via iterconnection for 3-D chip stacking package Ryu, C.; Chung, D.; Lee, J.; Lee, K.; Oh, T.; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, pp.151 - 154, 2005-10-24 | |
| Data-dependent Jitter using Single Pulse Analysis Method in High-speed Interconnection Kim, Joungho; Song, Eakhwan; Lee, Junho; Kim, Jingook; Kam, Dong Gun; Ryu, Chunghyun, 7th EPTC 2005, pp.810 - 813, 2005 | |
| Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications Choi, J.; Kam, D.G.; Chung, D.; Srinivasan, K.; Govind, V.; Kim, Joungho; Swaminathan, M., 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, v.2005, pp.69 - 72, IEEE, 2005-10-24 | |
| Networks-on-chip and networks-in-package for high-performance SoC platforms Lee, K.; Lee, S.-J.; Kim, D.; Kim, K.; Kim, G.; Kim, Joungho; Yoo, Hoi-Jun, 1st IEEE Asian Solid-State Circuits Conference, ASSCC 2005, pp.485 - 488, IEEE, 2005-11-01 | |
| Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design Park, H.; Kim, H.; Kam, D.G.; Kim, Joungho, 55th Electronic Components and Technology Conference, ECTC, pp.727 - 731, IEEE, 2005-05-31 | |
| System-on-Package ultra wideband transmitter with integrated bandpass filter and broad band planar antenna Kim, M.; Lee, J.; Park, Y.-J.; Kim, Joungho, 55th Electronic Components and Technology Conference, ECTC, pp.541 - 544, IEEE, 2005-05-31 | |
| Broadband suppression of SSN and radiated emissions using high-DK thin film EBG power distribution network for high-speed digital PCB applications Lee, J.; Kim, H.; Kim, Joungho, International Symposium on Electromagnetic Compatibility, EMC 2005, pp.967 - 970, IEEE, 2005-08-08 |
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