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Results 1-10 of 12 (Search time: 0.003 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Experimental verification and analysis for noise isolation of analog and digital chip-package-PCB hierarchical power distribution network

Park, H.; Shim, J.; Shim, Y.; Yoo, J.; Kim, Joungho, IEEE 9th VLSI Packaging Workshop in Japan, VPWJ 2008, pp.73 - 76, 2008-12-01

2
A dual-slope signaling scheme to suppress electromagnetic interference (EMI) with sustaining eye margin

Yoon, C.; Baek, S.; Lee, H.; Jeong, Y.; Park, J.; Park, H.; Sung, B.; Kim, Joungho, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, pp.143 - 146, 2008-10-27

3
High dielectric constant thin film embedded capacitor for suppression of simultaneous switching noise and radiated emission

Kim, H.; Park, H.; Jeong, Y.; Kim, Joungho; Lee, Kyu S.; Hong, Kuk J.; Hong, Y., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.588 - 591, 2004-08-09

4
Noise isolation modeling and experimental validation of power distribution network in chip-package

Park, H.; Yoon, C.; Koo, K.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09

5
Effect of power supply imbalance on nf of CMOS low noise amplifier for UHF RFID applications

Koo, K.; Shim, J.; Park, H.; Kim, Joungho, Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.431 - 434, 123, 2008-05-19

6
Noise figure degradation analysis of power/ground noise on 900MHz LNA for UHF RFID

Koo, K.; Park, H.; Shim, Y.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.416 - 420, IEEE, 2007-12-12

7
Modeling and simulation of IC and package power/ground network

Park, H.; Gam, D.G.; Kim, Joungho; Kim, H., 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.696 - 701, IEEE, 2006-08-14

8
Analysis of the effect of AC noise on DC bias of VGA for UHF RFID using chip-package co-modeling and simulation

Lee, H.; Shim, Y.; Park, H.; Ryu, C.; Yoon, C.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.591 - 594, IEEE, 2007-12-12

9
Design of UWB transceiver SiP for short range communication

Yoon, C.; Park, H.; Kim, Joungho; Lee, J.; Park, Y., IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09

10
Design of LTCC-based ultra-wideband transmitter SiP using CMOS impulse generator

Yoon, C.; Lee, J.; Kim, M.; Park, Y.; Park, H.; Lee, H.; Kim, Joungho, 8th Electronics Packaging Technology Conference, EPTC 2006, pp.85 - 89, IEEE, 2006-12-06

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