Search
Results 1-10 of 10 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board Lee, H.; Kim, J.; Ahn, S.; Byun, J.-G.; Kang, D.-S.; Choi, C.-S.; Hwang, H.-J.; Kim, Joungho, 2001 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.653 - 656, IEEE, 2001-08-13 | |
| Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system Kim, Joungho; Kim, H.; Lee, H.; Kim, J.; Kim, J., Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.59 - 62, 2001-07-08 | |
| An evaluation of differential impedance in PCBs using two single-ended probes only Kam, D.G.; Lee, H.; Ryu, W.; Kim, J.; Park, B.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.169 - 171, IEEE, 2002-05-12 | |
| Impact of partial EBG PDN on PI, SI and lumped model-based correlation Lee, J.; Lee, H.; Park, K.; Chung, B.; Kim, J.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.168 - 171, 2008-05-19 | |
| Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09 | |
| Through silicon via (TSV) equalizer Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19 | |
| Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB Pak, J.S.; Kim, J.; Lee, H.; Byun, J.-G.; Kim, Joungho, 2003 IEEE Symposium on Electromagnetic Compatibility, pp.231 - 235, IEEE, 2003-08-18 | |
| Sharing power distribution networks for enhanced power integrity by using through-silicon-via Pak, J.S.; Kim, Joungho; Lee, J.; Lee, H.; Park, K.; Kim, J., 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12, IEEE, 2008-12-10 | |
| Experimental investigation of radiated emission from flexible printed circuit (FPC) cable Ahn, S.; Kim, J.; Lee, H.; Kim, Joungho; Byun, J.-G.; Choi, C.-S.; Hwang, H.-J., IEEE International Symposium on Electromagnetic Compatibility, 2002, pp.883 - 888, IEEE, 2002-08-19 | |
| Equivalent circuit representation and dimension reduction technique for efficient FDTD modeling of power/ground plane Lee, H.; Kim, H.; Kim, Joungho; Jeong, Y.C.; Kim, J., IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2001, pp.145 - 148, IEEE, 2001-10-29 |