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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Overview of Power/Ground Effect on Data Eye and Clock Jitter; from Board Resonance to Substrate Coupling Chung, Daehyun; Kim, Hyungsoo; Kim, Joungho, IEEE 5th Electronics Packaging Technology Conference, pp.30 - 32, IEEE, 2003-12-12 | |
| Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system Jeong, Youchul; Kim, Hyungsoo; Kim, Jingook; Park, Jongbae; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.199 - 202, IEEE, 2003-10-27 | |
| Prediction and Verification of Power/Ground Plane Edge Radiation Excited by Through-Hole Signal Via Based on Balanced TLM and Via Coupling Model Pak, Jun So; Lee, Junwoo; Kim, Hyungsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.181 - 184, IEEE, 2003-10-27 | |
| Significant Reduction of Power/Ground Inductive Impedance and Simultaneous Switching Noise by Using Embedded Film Capacitor Kim, Hyungsoo; Jeong, Youchul; Park, Jongbae; Lee, SeokKyu; Hong, JongKuk; Hong, Youngsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.129 - 132, IEEE, 2003-10-27 | |
| Accurate Measurement of Power/Ground Impedance with Embedded Film Capacitor using Two-port Self-Impedance Measurement Technique Kim, Hyungsoo; Jeong, Youchul; Park, Joungbae; Lee, SeokKyu; Hong, JongKuk; Hong, Youngsoo; Kim, Joungho, IEEE 5th Electronics Packaging Technology Conference, pp.51 - 54, IEEE, 2003-12-10 |
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