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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Via: A Source of Simultaneous Switching Noise Generation, Coupling, and Edge Radiation in High-speed Multi-layer Digital PCB Kim, Joungho; Park, Jongbae; Pak, Jun So; Kim, Hyungsoo, 2004 Korea-Japan Joint Conference on AP/EMC/EMT (KJJC), pp.22 - 23, 2004-11 | |
| Analysis of Via Distribution Effect on Multi-layered Power/Ground Transfer Impedance of High-performance Packages Kim, Joungho; Kim, Hyungsoo; Kim, Jingook; Jeong, Youchul; Park, Jongbae, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.171 - 174, IEEE, 2002-10 | |
| An Efficient Hybrid Transmission Line Method (HTLM) for Analysis of Perforated Package Power/Ground Plane Kim, Joungho; Jeong, Youchul; Kim, Hyungsoo; Kim, Jingook; Park, Jongbae, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.179 - 183, IEEE, 2002-10 | |
| Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system Jeong, Youchul; Kim, Hyungsoo; Kim, Jingook; Park, Jongbae; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.199 - 202, IEEE, 2003-10-27 | |
| Significant Reduction of Power/Ground Inductive Impedance and Simultaneous Switching Noise by Using Embedded Film Capacitor Kim, Hyungsoo; Jeong, Youchul; Park, Jongbae; Lee, SeokKyu; Hong, JongKuk; Hong, Youngsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.129 - 132, IEEE, 2003-10-27 |
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