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Results 221-230 of 230 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Passive Equalizer Design Using Defected Ground Structure on PCBs Shim, Y; Lee, J; Kim, H; Kim, Joungho, Design Con 2010, Design Con 2010, 2010-10 | |
| Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers Kumar, Gokul; Raj, P. Markondeya; Cho, Jounghyun; Gandhi, Saumya; Chakraborti, Parthasarathi; Sundaram, Venky; Kim, Joungho; Tummala, Rao, 64th Electronic Components and Technology Conference, ECTC 2014, pp.541 - 547, Institute of Electrical and Electronics Engineers Inc., 2014-05 | |
| Modeling and Analysis of Power Supply Noise Effects on Analog-to-Digital Converter in 3DIC Bae, Bumhee; Shim, Yujeong; Cho, Jonghyun; Kim, Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2011, 2011-11-06 | |
| Magnetic Field Design for Low EMF and High Efficiency Wireless Power Transfer System in On-Line Electric Vehicle Ahn, Seungyoung; Lee, Ju Yong; Cho, Dong-Ho; Kim, Joungho, CIRP Design Conference 2011, CIRP Design Conference 2011, 2011-03 | |
| Noise Isolation Modeling of Partial EBG Power Bus using Segmentation Method and Cavity Model in Multi-layer PCBs Kim, Myunghoi; Koo, Kyoungchoul; Kim, Joungho, 2011 IEEE Electromagnetic Compatibility Symposium, 2011 IEEE Electromagnetic Compatibility Symposium, 2011-08-17 | |
| Channel Design for Wide System Bandwidth in a TSV based 3D IC Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Myunghoi; Lee, Junho; Lee, Hyungdng; Park, Kunwo; Kim, Joungho, 2011 Signal Propagation on Interconnects, 2011 Signal Propagation on Interconnects, 2010-12 | |
| Electromagnetic interference and radiation from wireless power transfer systems Kim, Jonghoon; Kim, Hongseok; Song, Chiuk; Kim, In-Myoung; Kim, Young-Il; Kim, Joungho, 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014, pp.171 - 176, Institute of Electrical and Electronics Engineers Inc., 2014-08 | |
| Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer Lee, Hyunsuk; Kim, Hee-Gon; Kim, Kiyeong; Jung, Daniel Hyunsuk; Kim, Jonghoon J; Choi, Sumin; Lim, Jaemin; Kim, Joungho; Kim, Hyungsoo; Park, Kunwoo, 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014, pp.850 - 854, Institute of Electrical and Electronics Engineers Inc., 2014-08 | |
| Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance Piersanti, S; De Paulis, F; Orlandi, A; Kim, Dong-Hyun; Cho, Jong-Hyun; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, pp.567 - 572, Institute of Electrical and Electronics Engineers Inc., 2015-08 | |
| Active Si interposer for 3D IC integrations Kim, Joungho, International 3D Systems Integration Conference, 3DIC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-08 |